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端粒DNA末端的加工需要复制叉的通过。

Processing of telomeric DNA ends requires the passage of a replication fork.

作者信息

Dionne I, Wellinger R J

机构信息

Département de Microbiologie et Infectiologie, Faculté de Médecine, Université de Sherbrooke, 3001 12ème Avenue Nord, Sherbrooke, Québec J1H 5N4, Canada.

出版信息

Nucleic Acids Res. 1998 Dec 1;26(23):5365-71. doi: 10.1093/nar/26.23.5365.

Abstract

During telomere replication in yeast, chromosome ends acquire a long single-stranded extension of the strand making the 3' end. Previous work showed that these 3' tails are generated late in S-phase, when conventional replication is virtually complete. In addition, the extensions were also observed in cells that lacked telomerase. Therefore, a model was proposed that predicted an activity that recessed the 5' ends at yeast telomeres after conventional replication was complete. Here, we demonstrate that this processing activity is dependent on the passage of a replication fork through yeast telomeres. A non-replicating linear plasmid with telomeres at each end does not acquire single-stranded extensions, while an identical construct containing an origin of replication does. Thus, the processing activity could be associated with the enzymes at the replication fork itself, or the passage of the fork through the telomeric sequences allows a transient access for the activity to the telomeres. We therefore propose that there is a mechanistic link between the conventional replication machinery and telomere maintenance.

摘要

在酵母端粒复制过程中,染色体末端会在形成3'端的链上获得一段长的单链延伸。先前的研究表明,这些3'尾巴是在S期后期产生的,此时常规复制实际上已经完成。此外,在缺乏端粒酶的细胞中也观察到了这种延伸。因此,有人提出了一个模型,该模型预测在常规复制完成后,存在一种使酵母端粒5'端凹陷的活性。在这里,我们证明这种加工活性依赖于复制叉通过酵母端粒。两端带有端粒的非复制型线性质粒不会获得单链延伸,而含有复制起点的相同构建体则会。因此,加工活性可能与复制叉本身的酶有关,或者复制叉通过端粒序列允许该活性短暂地作用于端粒。因此,我们提出常规复制机制与端粒维持之间存在机制上的联系。

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Telomere maintenance and the DNA damage response: a paradoxical alliance.端粒维持与DNA损伤反应:一种矛盾的联盟。
Front Cell Dev Biol. 2024 Oct 17;12:1472906. doi: 10.3389/fcell.2024.1472906. eCollection 2024.
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TERRA and Telomere Maintenance in the Yeast .酵母中的 TERRA 和端粒维护。
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