Bai Q, Wise K D, Anderson D J
Advanced Technology Department, Guidant Corporation, St. Paul, MN 55112-5798, USA.
IEEE Trans Biomed Eng. 2000 Mar;47(3):281-9. doi: 10.1109/10.827288.
This paper presents a practical microassembly process for three-dimensional (3-D) microelectrode arrays for recording and stimulation in the central nervous system (CNS). Orthogonal lead transfers between the micromachined two-dimensional probes and a cortical surface platform are formed by attaching gold beams on the probes to pads on the platform using wire-free ultrasonic bonding. The low-profile (150 microns) outrigger design of the probes allows the bonding of fully assembled high-density arrays. Micromachined assembly tools allow the formation of a full 3-D probe array within 30 min. Arrays having up to 8 x 16 shanks on 200-micron centers have been realized and used to record cortical single units successfully. Active 3-D probe arrays containing on-chip CMOS signal processing circuitry have also been created using the microassembly approach. In addition, a dynamic insertion technique has been explored to allow the implantation of high-density probe arrays into feline cortex at high-speed and with minimal traumatic injury.
本文介绍了一种用于中枢神经系统（CNS）记录和刺激的三维（3-D）微电极阵列的实用微组装工艺。通过使用无丝超声键合将微加工二维探针上的金梁连接到平台上的焊盘，在微加工二维探针和皮质表面平台之间形成正交引线转移。探针的低轮廓（150微米）支臂设计允许完全组装的高密度阵列进行键合。微加工组装工具可在30分钟内形成完整的三维探针阵列。已经实现了在200微米中心间距上具有多达8×16个柄的阵列，并成功用于记录皮质单个神经元。使用微组装方法还创建了包含片上CMOS信号处理电路的有源三维探针阵列。此外，还探索了一种动态插入技术，以允许将高密度探针阵列高速且创伤最小地植入猫科动物皮质。
