Rutten Wim L C
University of Twente, Biomedical Engineering Department, Faculty of Electrical Engineering & Institute for Biomedical Technology, 7500 AE Enschede, The Netherlands.
Annu Rev Biomed Eng. 2002;4:407-52. doi: 10.1146/annurev.bioeng.4.020702.153427. Epub 2002 Mar 22.
To achieve selective electrical interfacing to the neural system it is necessary to approach neuronal elements on a scale of micrometers. This necessitates microtechnology fabrication and introduces the interdisciplinary field of neurotechnology, lying at the juncture of neuroscience with microtechnology. The neuroelectronic interface occurs where the membrane of a cell soma or axon meets a metal microelectrode surface. The seal between these may be narrow or may be leaky. In the latter case the surrounding volume conductor becomes part of the interface. Electrode design for successful interfacing, either for stimulation or recording, requires good understanding of membrane phenomena, natural and evoked action potential generation, volume conduction, and electrode behavior. Penetrating multimicroelectrodes have been produced as one-, two-, and three-dimensional arrays, mainly in silicon, glass, and metal microtechnology. Cuff electrodes circumvent a nerve; their selectivity aims at fascicles more than at nerve fibers. Other types of electrodes are regenerating sieves and cone-ingrowth electrodes. The latter may play a role in brain-computer interfaces. Planar substrate-embedded electrode arrays with cultured neural cells on top are used to study the activity and plasticity of developing neural networks. They also serve as substrates for future so-called cultured probes.
为了实现与神经系统的选择性电连接,有必要在微米尺度上接近神经元元件。这就需要微技术制造,并引入了神经技术这一跨学科领域,它处于神经科学与微技术的交叉点。神经电子接口出现在细胞体或轴突的膜与金属微电极表面相遇的地方。它们之间的密封可能很窄,也可能有泄漏。在后一种情况下,周围的容积导体成为接口的一部分。为了成功实现连接,无论是用于刺激还是记录,电极设计都需要很好地理解膜现象、自然和诱发动作电位的产生、容积传导以及电极行为。穿透式多微电极已被制造成一维、二维和三维阵列,主要采用硅、玻璃和金属微技术。袖带电极环绕神经;它们的选择性针对的是神经束而非神经纤维。其他类型的电极有再生筛网电极和锥形生长电极。后者可能在脑机接口中发挥作用。顶部带有培养神经细胞的平面基底嵌入式电极阵列用于研究发育中神经网络的活性和可塑性。它们还可作为未来所谓培养探针的基底。