Sedberry D, Burgess J, Schwartz R
Wilford Hall USAF Medical Center, Lackland Air Force Base, Tex.
J Prosthet Dent. 1992 Oct;68(4):606-10. doi: 10.1016/0022-3913(92)90373-i.
This study compared the tensile bond strength of Rexillium III disks etched by three chemical etching systems and the electrochemical etching technique. Cast Rexillium III disks were etched by the following etching systems: electrochemical, Assure-Etch, Met-Etch gel, and Etch-It gel. Thermocycled samples were loaded to failure in tension on an Instron testing machine using a crosshead speed of 5 mm/minute. Samples etched electrochemically yielded significantly greater bond strengths than those etched chemically (p less than 0.05). The rank of the groups was: Electrochemical greater than Assure-Etch = Met-Etch greater than Etch-It. Scanning electron micrograph evaluations of the etching patterns supported the bond strength determinations.
本研究比较了三种化学蚀刻系统和电化学蚀刻技术蚀刻的Rexillium III盘的拉伸粘结强度。铸造的Rexillium III盘通过以下蚀刻系统进行蚀刻：电化学蚀刻、Assure-Etch蚀刻、Met-Etch凝胶蚀刻和Etch-It凝胶蚀刻。热循环后的样品在英斯特朗测试机上以5毫米/分钟的十字头速度加载至拉伸破坏。电化学蚀刻的样品产生的粘结强度明显高于化学蚀刻的样品（p小于0.05）。各实验组的排序为：电化学蚀刻组＞Assure-Etch蚀刻组 = Met-Etch蚀刻组＞Etch-It蚀刻组。蚀刻图案的扫描电子显微镜评估结果支持了粘结强度的测定结果。
