Gruber Matthias
Lehrgebiet Optische Nachrichtentechnik, Fern Universität Hagen, Universitätsstrasse 27, 58084 Hagen, Germany.
Appl Opt. 2004 Jan 10;43(2):463-70. doi: 10.1364/ao.43.000463.
Even in the semiconductor industry, free-space optical technology is nowadays seen as a prime option for solving the continually aggravating problem with VLSI chips, namely, that the interconnect technology has failed to keep pace with the increase in communication volume. To make free-space optics compatible with established lithography-based design and fabrication techniques the concept of planar integration was proposed approximately a decade ago. Here its evolution into a photonic microsystems engineering concept is described. For demonstration, a multichip module with planar-integrated freespace optical vector-matrix-type interconnects was designed and built. It contains flip-chip-bonded vertical-cavity surface emitting laser arrays and a hybrid chip with an array of multiple-quantum-well p-i-n diodes on top of a standard complementary metal-oxide semiconductor circuit as key optoelectronic hardware components. The optical system is integrated into a handy fused-silica substrate and fabricated with surface-relief diffractive phase elements. It has been optimized for the given geometrical and technological constraints and provides a good interconnection performance, as was verified in computer simulations on the basis of ray tracing and in practical experiments.
即使在半导体行业，如今自由空间光学技术也被视为解决超大规模集成电路芯片不断加剧的问题的首要选择，即互连技术未能跟上通信量增长的步伐。大约十年前，为使自由空间光学与既定的基于光刻的设计和制造技术兼容，提出了平面集成的概念。本文描述了其向光子微系统工程概念的演变。为作演示，设计并构建了一个具有平面集成自由空间光学矢量矩阵型互连的多芯片模块。它包含倒装芯片键合的垂直腔面发射激光器阵列以及一个混合芯片，该混合芯片在标准互补金属氧化物半导体电路之上有一个多量子阱p-i-n二极管阵列，作为关键的光电子硬件组件。光学系统集成到一个方便的熔融石英衬底中，并通过表面浮雕衍射相位元件制造。它已针对给定的几何和技术限制进行了优化，并提供了良好的互连性能，这在基于光线追踪的计算机模拟和实际实验中得到了验证。
