Zheng X, Marchand P J, Huang D, Kibar O, Ozkan N S, Esener S C
Department of Electrical and Computer Engineering, University of California at San Diego, La Jolla, California 92093-0407, USA.
Appl Opt. 1999 Sep 10;38(26):5631-40. doi: 10.1364/ao.38.005631.
We present a proof of concept and a feasibility demonstration of a practical packaging approach in which free-space optical interconnects (FSOI's) can be integrated simply on electronic multichip modules (MCM's) for intra-MCM-board interconnects. Our system-level packaging architecture is based on a modified folded 4f imaging system that has been implemented with only off-the-shelf optics, conventional electronic packaging, and passive-assembly techniques to yield a potentially low-cost and manufacturable packaging solution. The prototypical system as built supports 48 independent FSOI channels with 8 separate laser and detector chips, for which each chip consists of a one-dimensional array of 12 devices. All the chips are assembled on a single substrate that consists of a printed circuit board or a ceramic MCM. Optical link channel efficiencies of greater than 90% and interchannel cross talk of less than -20 dB at low frequency have been measured. The system is compact at only 10 in.3 (25.4 cm3) and is scalable, as it can easily accommodate additional chips as well as two-dimensional optoelectronic device arrays for increased interconnection density.
我们展示了一种概念验证和一种实用封装方法的可行性演示，在这种方法中，自由空间光互连（FSOI）可以简单地集成在电子多芯片模块（MCM）上，用于MCM板内互连。我们的系统级封装架构基于一种改进的折叠4f成像系统，该系统仅采用现成的光学器件、传统电子封装和无源组装技术实现，以产生一种潜在低成本且可制造的封装解决方案。所构建的原型系统支持48个独立的FSOI通道，带有8个单独的激光和探测器芯片，每个芯片由12个器件的一维阵列组成。所有芯片都组装在单个基板上，该基板由印刷电路板或陶瓷MCM组成。已测量出光链路通道效率大于90%，低频下通道间串扰小于-20 dB。该系统紧凑，仅10立方英寸（25.4立方厘米），并且可扩展，因为它可以轻松容纳额外的芯片以及二维光电器件阵列，以提高互连密度。
