Zaleta D, Fan J, Kress B C, Lee S H, Cheng C K
Appl Opt. 1994 Mar 10;33(8):1444-56. doi: 10.1364/AO.33.001444.
Decreasing the system volume for optoelectronic (OE) planar systems is achieved by advancing computer-aided design of OE multichip modules (MCM's). It is shown that in order to minimize the volume in an OE MCM, it is necessary to minimize the maximum interconnect distance. To achieve this, we have developed placement algorithms based on the constraints of a given irregular interconnect pattern. Results are given for a twin-butterfly network for two general physical models: a transmissive MCM and a reflective MCM. We then show three different types of hologram design that can be used to implement the interconnect array. These elements are for reconstruction in the near field and are fabricated by direct-write electron-beam lithography. Both simulated and experimental reconstructions are demonstrated.
通过推进光电子（OE）多芯片模块（MCM）的计算机辅助设计，可以减小光电子平面系统的系统体积。结果表明，为了使OE MCM的体积最小化，有必要使最大互连距离最小化。为实现这一点，我们基于给定不规则互连模式的约束条件开发了布局算法。给出了针对两种通用物理模型的双蝶形网络的结果：透射式MCM和反射式MCM。然后，我们展示了三种可用于实现互连阵列的不同类型的全息图设计。这些元件用于近场重建，并通过直写电子束光刻制造。展示了模拟重建和实验重建结果。
