Luesebrink Helge, Glinsner Thomas, Jakeway Stephen C, Crabtree H John, Cameron Neil S, Roberge Hélène, Veres Teodor
EV Group GmbH, DI Erich Thallner Street 1, A-4780 Schaerding, Austria.
J Nanosci Nanotechnol. 2005 Jun;5(6):864-8. doi: 10.1166/jnn.2005.129.
The transition of MEMS technology to nano fabrication is a solution to the growing demand for smaller and high-density feature sizes in the nanometer scale. Nanoimprint lithography (NIL) techniques for fabricating micro- and nano-features are discussed including hot embossing lithography (HEL), UV Molding (UVM) and micro contact printing (microCP). Recent results in micro and nano-pattern transfer are presented where features ranged from < 100 nm to several centimeters. We also present a comparative study between standard glass microfluidic chips and their HEL counterparts by metrology. Hot-embossed microfluidic chips are shown to be faithful replicates of their parent stamps. NIL is presented as a promising avenue for low-cost, high throughput micro and nano-device fabrication.
微机电系统（MEMS）技术向纳米制造的转变是满足纳米尺度上对更小尺寸和高密度特征尺寸不断增长需求的一种解决方案。本文讨论了用于制造微米和纳米特征的纳米压印光刻（NIL）技术，包括热压印光刻（HEL）、紫外模塑（UVM）和微接触印刷（microCP）。展示了近期微米和纳米图案转移的成果，其中特征尺寸范围从小于100纳米到几厘米。我们还通过计量学对标准玻璃微流控芯片及其热压印对应芯片进行了比较研究。结果表明，热压印微流控芯片是其母版印章的忠实复制品。纳米压印光刻被认为是一种有前景的低成本、高通量微米和纳米器件制造途径。
