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降低足底足跟压力:使用有限元分析的鞋垫设计

Reduction of plantar heel pressures: Insole design using finite element analysis.

作者信息

Goske Steven, Erdemir Ahmet, Petre Marc, Budhabhatti Sachin, Cavanagh Peter R

机构信息

Department of Biomedical Engineering, Saint Louis University, St. Louis, MO 63103, USA.

出版信息

J Biomech. 2006;39(13):2363-70. doi: 10.1016/j.jbiomech.2005.08.006. Epub 2005 Sep 28.

DOI:10.1016/j.jbiomech.2005.08.006
PMID:16197952
Abstract

Plantar heel pain is a common condition that is often exacerbated by the repetitive stresses of walking. Treatment usually includes an in-shoe intervention designed to reduce plantar pressure under the heel by using insoles and a variety of off-the-shelf products. The design process for these products is often intuitive in nature and does not always rely on scientifically derived guidelines. Finite element analysis provides an efficient computational framework to investigate the performance of a large number of designs for optimal plantar pressure reduction. In this study, we used two-dimensional plane strain finite element modeling to investigate 27 insole designs. Combinations of three insole conformity levels (flat, half conforming, full conforming), three insole thickness values (6.3, 9.5 and 12.7 mm) and three insole materials (Poron Cushioning, Microcel Puff Lite and Microcel Puff) were simulated during the early support phase of gait. Plantar pressures predicted by the model were validated by experimental trials conducted in the same subject whose heel was modeled by loading the bare foot on a rigid surface and on foam mats. Conformity of the insole was the most important design variable, whereas peak pressures were relatively insensitive to insole material selection. The model predicted a 24% relief in pressure compared to barefoot conditions when using flat insoles; the reduction increased up to 44% for full conforming insoles.

摘要

足跟足底疼痛是一种常见病症,经常因行走时的反复压力而加重。治疗通常包括鞋内干预措施,即使用鞋垫和各种现成产品来减轻足跟下方的足底压力。这些产品的设计过程通常凭直觉进行,并不总是依赖科学推导的指导原则。有限元分析提供了一个有效的计算框架,用于研究大量设计以实现最佳的足底压力减轻效果。在本研究中,我们使用二维平面应变有限元建模来研究27种鞋垫设计。在步态的早期支撑阶段,模拟了三种鞋垫贴合度水平(平坦、半贴合、全贴合)、三种鞋垫厚度值(6.3、9.5和12.7毫米)以及三种鞋垫材料(泡棉缓冲材料、微孔轻量泡棉和微孔泡棉)的组合。通过在同一受试者身上进行的实验试验对模型预测的足底压力进行了验证,该受试者的足跟模型是通过将裸足加载在刚性表面和泡沫垫上建立的。鞋垫的贴合度是最重要的设计变量,而峰值压力对鞋垫材料的选择相对不敏感。该模型预测,使用平坦鞋垫时与赤脚条件相比压力可减轻24%;对于全贴合鞋垫,压力减轻幅度可增至44%。

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