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室温离子液体1-丁基-1-甲基吡咯烷双(三氟甲基磺酰)亚胺中Au(111)表面金重构及硅电沉积的原位扫描隧道显微镜研究

In situ STM investigation of gold reconstruction and of silicon electrodeposition on Au(111) in the room temperature ionic liquid 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl)imide.

作者信息

Borisenko N, Zein El Abedin S, Endres F

机构信息

Faculty of Natural and Materials Sciences, Clausthal University of Technology, Robert-Koch-Strasse 42, D-38678 Clausthal-Zellerfeld, Germany.

出版信息

J Phys Chem B. 2006 Mar 30;110(12):6250-6. doi: 10.1021/jp057337d.

Abstract

The electrodeposition of silicon on Au(111) was investigated by cyclic voltammety (CV) and by in situ scanning tunneling microscopy (STM) in the room temperature ionic liquid 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl)imide with a SiCl(4) concentration of 0.1 mol/L. A main reduction process begins in the cyclic voltammogram at about -1800 mV versus ferrocene/ferrocinium, which is correlated to the electrodeposition of elemental semiconducting silicon. It has been found that at an electrode potential more negative than the open circuit potential (OCP), the Au(111) surface is subject to a restructuring/reconstruction both in the case of the pure ionic liquid and in the presence of SiCl(4). The first STM-probed silicon islands with 150-450 pm in height appear at about -1700 mV versus ferrocene/ferrocinium. Their lateral and vertical growth leads to the formation of a rough layer with silicon islands of up to 1 nm in height. At about -1800 mV the islands merge and form silicon agglomerates. In situ I/U tunneling spectroscopy reveals a band gap of 1.1 +/- 0.2 eV for layers of about 5 nm in height, a value that has to be expected for semiconducting silicon.

摘要

在室温离子液体1-丁基-1-甲基吡咯烷双(三氟甲基磺酰)亚胺中,SiCl₄浓度为0.1 mol/L,通过循环伏安法(CV)和原位扫描隧道显微镜(STM)研究了硅在Au(111)上的电沉积。在循环伏安图中,相对于二茂铁/二茂铁鎓,一个主要的还原过程在约-1800 mV处开始,这与元素半导体硅的电沉积相关。已发现,在电极电位比开路电位(OCP)更负时,无论是在纯离子液体中还是在有SiCl₄存在的情况下,Au(111)表面都会发生重构/重建。相对于二茂铁/二茂铁鎓,第一批STM探测到的高度为150 - 450 pm的硅岛出现在约-1700 mV处。它们的横向和纵向生长导致形成高度达1 nm的硅岛的粗糙层。在约-1800 mV时,这些岛合并形成硅团聚体。原位I/U隧道光谱显示,高度约为5 nm的层的带隙为1.1±0.2 eV,这是半导体硅所预期的值。

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