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一种基于薄铸法的刚性聚二甲基硅氧烷夹心式电泳微芯片。

A rigid poly(dimethylsiloxane) sandwich electrophoresis microchip based on thin-casting method.

作者信息

Liu Changchun, Cui Dafu, Cai Haoyuan, Chen Xing, Geng Zhaoxin

机构信息

State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing, P. R. China.

出版信息

Electrophoresis. 2006 Jul;27(14):2917-23. doi: 10.1002/elps.200500581.

Abstract

We present a novel concept of glass/poly(dimethylsiloxane) (PDMS)/glass sandwich microchip and developed a thin-casting method for fabrication. Unlike the previously reported casting method for fabricating PDMS microchip, several drops of PDMS prepolymer were first added on the silanizing SU-8 master, then another glass plate was placed over the prepolymer as a cover plate, and formed a glass plate/PDMS prepolymer/SU-8 master sandwich mode. In order to form a thin PDMS membrane, a weight was placed on the glass plate. After the whole sandwich mode was cured at 80 degrees C for 30 min, the SU-8 master was easily peeled and the master microstructures were completely transferred to the PDMS membrane which was tightly stuck to the glass plate. The microchip was subsequently assembled by reversible sealing with the glass cover plate. We found that this PDMS sandwich microchip using the thin-casting method could withstand internal pressures of >150 kPa, more than 5 times higher than that of the PDMS hybrid microchip with reversible sealing. In addition, it shows an excellent heat-dissipating property and provides a user-friendly rigid interface just like a glass microchip, which facilitates manipulation of the microchip and fix tubing. As an application, PDMS sandwich microchips were tested in the capillary electrophoresis separation of fluorescein isothiocyanate-labeled amino acids.

摘要

我们提出了一种新型的玻璃/聚二甲基硅氧烷(PDMS)/玻璃夹层微芯片概念,并开发了一种用于制造的薄铸法。与先前报道的用于制造PDMS微芯片的铸法不同,首先将几滴PDMS预聚物添加到硅烷化的SU-8母版上,然后将另一块玻璃板作为盖板放置在预聚物上方,形成玻璃板/PDMS预聚物/SU-8母版夹层模式。为了形成薄的PDMS膜,在玻璃板上放置一个重物。在80℃下将整个夹层模式固化30分钟后,SU-8母版很容易被剥离,并且母版的微观结构被完全转移到紧密粘附在玻璃板上的PDMS膜上。随后通过与玻璃盖板可逆密封来组装微芯片。我们发现,使用薄铸法的这种PDMS夹层微芯片能够承受大于150 kPa的内部压力,比具有可逆密封的PDMS混合微芯片高5倍以上。此外,它显示出优异的散热性能,并提供了一个像玻璃微芯片一样用户友好的刚性界面,这便于微芯片的操作和固定管路。作为一种应用,PDMS夹层微芯片在异硫氰酸荧光素标记的氨基酸的毛细管电泳分离中进行了测试。

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