Factors affecting the preparation and properties of electrodeposited silica thin films functionalized with amine or thiol groups.

Well-adherent sol-gel-derived silica films functionalized with amine or thiol groups have been electrogenerated on gold electrodes and both the deposition process and the film properties have been studied by various physicochemical techniques. Electrodeposition was achieved by combining the formation of a self-assembled "nanoglue" on the electrode surface, the sol-gel process, and the electrochemical manipulation of pH to catalyze polycondensation of the precursors. Gold electrodes pretreated with mercaptopropyltrimethoxysilane (MPTMS) were immersed in sol solutions containing the selected precursors (tetraethoxysilane, TEOS, in mixture with (3-aminopropyl)triethoxysilane, APTES, or MPTMS) where they underwent a cathodic electrolysis to generate the hydroxyl ions that are necessary to catalyze the formation of the organosilica films on the electrode surface. Special attention was given to analyze the effects of deposition time and applied potential and to compare APTES and MPTMS films. Characterization was made using quartz crystal microbalance, scanning electron microscopy, cyclic voltammetry, and atomic force microscopy (including in situ monitoring). The electrodeposition process was found to occur at two growing rates: a first slow stage giving rise to rather homogeneous, yet rough, films with thickness in the sub-mum range (increasing continuously when increasing the deposition time), which was followed by a faster gelification step resulting in much thicker (>1 microm) and rougher macroporous deposits. These two successive situations were observed independently on the applied potential except that more cathodic values led to narrower sub-microm ranges (as expected from the larger amounts of the electrogenerated hydroxyl catalyst). Thiol-functionalized silica films were deposited more rapidly than the amine ones and, for both of them, permeability to redox probe was found to decrease when increasing the film thickness because of higher resistance to mass transport.