Martins Giovana Ribeiro, Cavalcanti Bruno Neves, Rode Sigmar Mello
School of Dentistry, Ibirapuera University, Sao Paulo, SP, Brazil.
J Prosthet Dent. 2006 Nov;96(5):328-31. doi: 10.1016/j.prosdent.2006.09.008.
The polymerization of dental composite resins can generate increases in intrapulpal temperature that may damage the pulp. The development of new polymerization devices such as the argon laser makes the assessment of these temperatures important.
This study compared increases in temperature generated by argon laser and halogen light when polymerizing a bonding system and a composite resin, and also sought to determine whether both types of polymerization lights generate temperature increases below the safe limit of 5.5 degrees C.
Thermocouples linked to a temperature reading system were positioned in the pulp chamber of 10 extracted bovine incisors. Class V cavities were prepared, etched, and filled with a 1-bottle bonding system (Single Bond) and composite resin (Z-100). The test groups were as follows (n = 5 for all groups): halogen light for bonding system (HB); halogen light for composite resin (HC); argon laser for bonding system (LB), and argon laser for composite resin (LC). The polymerization parameters were halogen light operated at 600 mW/cm2 for 40 seconds, which served as control, and argon laser operated at 200 mW for 10 seconds. Data were analyzed by a 2-way (light versus material) analysis of variance (ANOVA) (alpha = .05).
The average temperature increases were 2.35 degrees C (HB), 2.69 degrees C (HC), 1.25 degrees C (LB), and 1.5 degrees C (LC). Significant differences between halogen light and argon laser (P = .002), but not between composite and bonding system, were demonstrated.
The argon laser produced significantly lower increases in pulpal temperature than the halogen light, independent of the thickness of the polymerized material.
牙科复合树脂的聚合会导致牙髓腔内温度升高,这可能会损害牙髓。诸如氩激光等新型聚合装置的出现使得对这些温度的评估变得重要。
本研究比较了氩激光和卤素灯在聚合粘结系统和复合树脂时产生的温度升高情况,并试图确定这两种类型的聚合光产生的温度升高是否低于5.5摄氏度的安全限度。
将与温度读取系统相连的热电偶置于10颗拔除的牛切牙的牙髓腔中。制备V类洞,酸蚀后用单瓶装粘结系统(Single Bond)和复合树脂(Z - 100)填充。测试组如下(所有组n = 5):粘结系统用卤素灯(HB);复合树脂用卤素灯(HC);粘结系统用氩激光(LB),以及复合树脂用氩激光(LC)。聚合参数为卤素灯以600 mW/cm²运行40秒作为对照,氩激光以200 mW运行10秒。数据通过双因素(光与材料)方差分析(ANOVA)进行分析(α = .05)。
平均温度升高分别为2.35摄氏度(HB)、2.69摄氏度(HC)、1.25摄氏度(LB)和1.5摄氏度(LC)。卤素灯和氩激光之间存在显著差异(P = .002),但复合树脂和粘结系统之间没有差异。
无论聚合材料的厚度如何,氩激光产生的牙髓温度升高均显著低于卤素灯。