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一项关于使用不同光固化设备进行复合树脂聚合时髓腔内温度升高的研究。

A study of temperature rise in the pulp chamber during composite polymerization with different light-curing units.

作者信息

Millen Christopher, Ormond Martyn, Richardson Gillian, Santini Ario, Miletic Vesna, Kew Peter

机构信息

Edinburgh Postgraduate Dental Institute, The University of Edinburgh, Edinburgh, UK.

出版信息

J Contemp Dent Pract. 2007 Nov 1;8(7):29-37.

PMID:17994152
Abstract

AIM

The study compared pulp temperature rise during polymerization of resin-based composites (RBCs) using halogen and LED light-curing units (LCUs).

METHODS AND MATERIALS

A total of 32 teeth extracted from patients aged 11-18 years were used in the study. Thermocouples placed on the roof of the pulp chamber using a novel 'split-tooth' method. In Group 1 a halogen LCU with a light intensity of 450 mW cm(-2) was used and in Group 2, an LED LCU with a light intensity of 1100 mW cm(-2) was used. The teeth were placed in a water bath with the temperature regulated until both the pulp temperature and the ambient temperature were stable at 37 degrees C. Continuous temperature records were made via a data logger and computer. The increase in temperature from baseline to maximum was calculated for each specimen during the curing of both the bonding agent and the RBC.

RESULTS

The rise in pulp temperature was significantly higher with the LED LCU than with the halogen LCU for bonding and RBC curing (p<0.05). The major rise in temperature occurred during the curing of the bonding agent. During the curing of the RBC, rises were smaller.

CONCLUSIONS

Curing of bonding agents should be done with low intensity light and high intensity used only for curing RBC regardless of whether LED or halogen LCUs are used.

摘要

目的

本研究比较了使用卤素光固化单元(LCU)和发光二极管(LED)光固化单元进行树脂基复合材料(RBC)聚合时牙髓温度的升高情况。

方法和材料

本研究共使用了32颗从11 - 18岁患者口中拔除的牙齿。采用一种新颖的“劈牙”方法将热电偶放置在髓腔顶部。第1组使用光强度为450 mW/cm²的卤素光固化单元,第2组使用光强度为1100 mW/cm²的发光二极管光固化单元。将牙齿置于温度可控的水浴中,直至牙髓温度和环境温度均稳定在37℃。通过数据记录器和计算机进行连续温度记录。在粘结剂和树脂基复合材料固化过程中,计算每个样本从基线到最高温度的升高值。

结果

在粘结和树脂基复合材料固化过程中,发光二极管光固化单元导致的牙髓温度升高显著高于卤素光固化单元(p<0.05)。温度的主要升高发生在粘结剂固化过程中。在树脂基复合材料固化过程中,温度升高较小。

结论

无论使用发光二极管还是卤素光固化单元,粘结剂固化都应使用低强度光,高强度光仅用于树脂基复合材料的固化。

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