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在正畸粘接过程中牙髓内温度上升的体外评估。

In-vitro assessment of temperature rise in the pulp during orthodontic bonding.

机构信息

Department of Orthodontics, and Chair, School of Dentistry, University of Inönü, Malatya, Turkey.

出版信息

Am J Orthod Dentofacial Orthop. 2010 Mar;137(3):379-83. doi: 10.1016/j.ajodo.2008.02.028.

DOI:10.1016/j.ajodo.2008.02.028
PMID:20197176
Abstract

INTRODUCTION

In this in-vitro study, we evaluated the temperature changes in the pulp chamber during bracket bonding using 4 different light sources.

METHODS

Eighty intact extracted maxillary central incisors were used. The teeth were divided into 4 groups of 20 teeth each. Brackets (Mini Twin, Dentaurum, Ispringen, Germany) were bonded with Transbond XT (3M Unitek, Monrovia, Calif) adhesive and light cured with low-intensity halogen light for 40 seconds, high-intensity halogen light for 40 seconds, light-emitting diode (LED) light for 20 seconds, and plasma arc light (PAC) for 6 seconds. Light curing was performed 5 mm from tooth surfaces. A J-type thermocouple wire was positioned in the center of the pulp chamber. The results were analyzed with analysis of variance (ANOVA) and the Tukey HSD test.

RESULTS

ANOVA and the Tukey HSD test showed that pulp chamber temperature changes were influenced by the type of light source. All groups showed significant differences between each other (P <0.001). The intrapulpal temperature changes induced by different light sources were the following: high-intensity halogen (6.84 degrees C +/- 2.44 degrees C), low-intensity halogen (4.71 degrees C +/- 0.96 degrees C), LED (2.95 degrees C +/- 1.12 degrees C), and PAC (0.96 degrees C +/- 0.83 degrees C).

CONCLUSIONS

High- and low-intensity halogen light induced significantly higher intrapulpal temperature changes than did the LED and PAC. Except for the high intensity halogen light, orthodontic bonding with light-curing units did not exceed the critical 5.5 degrees C rise in temperature reported to produce pulpal damage.

摘要

简介

本体外研究通过 4 种不同光源,评估了托槽粘接过程中牙髓腔的温度变化。

方法

使用 80 颗完整的上颌中切牙,将牙齿分为 4 组,每组 20 颗牙。使用 Transbond XT(3M Unitek,Monrovia,加利福尼亚州)胶粘剂粘接托槽(Mini Twin,Dentaurum,Ispringen,德国),并用低强度卤素光照射 40 秒,高强度卤素光照射 40 秒,发光二极管(LED)光照射 20 秒,等离子电弧光(PAC)照射 6 秒。光固化距离牙面 5mm。将 J 型热电偶丝置于牙髓腔中心。采用方差分析(ANOVA)和 Tukey HSD 检验对结果进行分析。

结果

ANOVA 和 Tukey HSD 检验表明,牙髓腔温度变化受光源类型的影响。各组之间差异均有统计学意义(P <0.001)。不同光源引起的牙髓内温度变化如下:高强度卤素光(6.84°C ± 2.44°C)、低强度卤素光(4.71°C ± 0.96°C)、LED(2.95°C ± 1.12°C)和 PAC(0.96°C ± 0.83°C)。

结论

高强度和低强度卤素光引起的牙髓内温度变化明显高于 LED 和 PAC。除高强度卤素光外,光固化粘接正畸托槽不会超过据报道引起牙髓损伤的临界 5.5°C 温升。

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