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采用紫外线/臭氧表面处理实现聚甲基丙烯酸甲酯(PMMA)与环烯烃共聚物(COC)微流体基板的低温键合。

Low temperature bonding of PMMA and COC microfluidic substrates using UV/ozone surface treatment.

作者信息

Tsao C W, Hromada L, Liu J, Kumar P, DeVoe D L

机构信息

Department of Mechanical Engineering, University of Maryland, College Park, MD, USA.

出版信息

Lab Chip. 2007 Apr;7(4):499-505. doi: 10.1039/b618901f. Epub 2007 Mar 7.

Abstract

The use of UV/ozone surface treatments for achieving low temperature bonds between PMMA and COC microfluidic substrates is evaluated. Low temperature bond strengths, approaching those of native polymer substrates bonded above their glass transition temperatures, are demonstrated for both thermoplastics. To evaluate the effects of the UV/O(3) surface treatment on the operation of bonded microfluidic devices, the relationship between UV/O(3) exposure and polymer hydrophilicity and surface chemistry are measured. Post-treatment surface chemistry is evaluated by XPS (X-ray photoelectron spectroscopy) analysis, and the stability of the treated surfaces following solvent exposure is reported. Electroosmotic flow within fabricated microchannels with modified wall surfaces is also characterized. Overall, UV/O(3) treatment is found to enable strong low temperature bonds between thermoplastic microfluidic substrates using a simple, low cost, and high throughput fabrication technology.

摘要

评估了使用紫外线/臭氧表面处理来实现聚甲基丙烯酸甲酯(PMMA)和环烯烃共聚物(COC)微流体基板之间的低温键合。对于这两种热塑性塑料,均展示出接近在玻璃化转变温度以上键合的天然聚合物基板的低温键合强度。为了评估紫外线/臭氧(UV/O(3))表面处理对键合微流体装置运行的影响,测量了UV/O(3)暴露与聚合物亲水性和表面化学之间的关系。通过X射线光电子能谱(XPS)分析评估后处理表面化学,并报告溶剂暴露后处理表面的稳定性。还对具有改性壁表面的制造微通道内的电渗流进行了表征。总体而言,发现UV/O(3)处理能够使用简单、低成本且高通量的制造技术在热塑性微流体基板之间实现牢固的低温键合。

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