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表面和弛豫损失对价电子能量损失谱的影响。

The impact of surface and retardation losses on valence electron energy-loss spectroscopy.

作者信息

Erni Rolf, Browning Nigel D

机构信息

EMAT, University of Antwerp, Groenenborgerlaan 171, B 2020 Antwerp, Belgium.

出版信息

Ultramicroscopy. 2008 Jan;108(2):84-99. doi: 10.1016/j.ultramic.2007.03.005. Epub 2007 Mar 27.

Abstract

The inelastic scattering of fast electrons transmitting thin foils of silicon (Si), silicon nitride (Si(3)N(4)), gallium arsenide (GaAs), gallium nitride (GaN) and cadmium selenide (CdSe) was analyzed using dielectric theory. In particular, the impact of surface and bulk retardation losses on valence electron energy-loss spectroscopy (VEELS) was studied as a function of the foil thickness. It is shown that for the materials analyzed, surface and retardation losses can cause a systematic, thickness-dependent modulation of the dielectric volume losses, which can hamper the determination of the bulk dielectric data as well as the identification of band-gap and interband transition energies by VEELS. For Si and GaAs, where the dielectric function is strongly peaked with high absolute values, retardation losses lead to additional intensity maxima in the spectrum. For thin films of these materials (below approximately 100 nm), the additional intensity maxima are related to retardation effects due to the finite size of the sample leading to the excitation of guided light modes. For thicker films, exceeding about 200 nm, the intensity maxima are caused by bulk retardation losses, i.e., Cerenkov losses. Although thickness-dependent modulations were observed for Si(3)N(4), GaN and CdSe, the form of the dielectric functions and their lower maxima, means that for TEM samples < 100 nm thick, the band-gap energies of these materials can be accurately identified by VEELS. Guidelines are given that allow for forecasting the impact of surface and retardation losses on VEELS.

摘要

利用介电理论分析了快速电子穿过硅(Si)、氮化硅(Si₃N₄)、砷化镓(GaAs)、氮化镓(GaN)和硒化镉(CdSe)薄箔时的非弹性散射。特别地,研究了表面和体延迟损耗对价电子能量损失谱(VEELS)的影响,并将其作为箔厚度的函数。结果表明,对于所分析的材料,表面和延迟损耗会导致介电体体积损耗出现系统性的、与厚度相关的调制,这可能会妨碍通过VEELS确定体介电数据以及识别带隙和带间跃迁能量。对于介电函数具有高绝对值且强烈峰值的Si和GaAs,延迟损耗会导致光谱中出现额外的强度最大值。对于这些材料的薄膜(厚度约低于100 nm),额外的强度最大值与样品有限尺寸导致的延迟效应有关,从而激发了导光模式。对于厚度超过约200 nm的较厚薄膜,强度最大值是由体延迟损耗,即切伦科夫损耗引起的。尽管观察到Si₃N₄、GaN和CdSe存在与厚度相关的调制,但介电函数的形式及其较低的最大值意味着,对于厚度小于100 nm的透射电子显微镜(TEM)样品,可以通过VEELS准确识别这些材料的带隙能量。文中给出了一些指导方针,可用于预测表面和延迟损耗对VEELS的影响。

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