Maiti Debabrata, Woertink Julia S, Vance Michael A, Milligan Ashley E, Sarjeant Amy A Narducci, Solomon Edward I, Karlin Kenneth D
Department of Chemistry, Johns Hopkins University, Baltimore, Maryland 21218, USA.
J Am Chem Soc. 2007 Jul 18;129(28):8882-92. doi: 10.1021/ja071968z. Epub 2007 Jun 26.
Elemental sulfur (S8) reacts reversibly with the copper(I) complex (TMPA')CuI (1), where TMPA' is a TMPA (tris(2-pyridylmethyl)amine) analogue with a 6-CH2OCH3 substituent on one pyridyl ligand arm, affording a spectroscopically pure end-on bound disulfido-dicopper(II) complex {(TMPA')Cu(II)}2(mu-1,2-S2(2-)) (2) {nu(S-S) = 492 cm(-1); nu(Cu-S)sym = 309 cm(-1)}; by contrast, (TMPA)Cu(I)(CH3CN) (3)/S8 chemistry produces an equilibrium mixture of at least three complexes. The reaction of excess PPh3 with 2 leads to formal "release" of zerovalent sulfur and reduction of copper ion to give the corresponding complex (TMPA')Cu(I)(PPh3) (11) along with S=PPh3 as products. Dioxygen displaces the disulfur moiety from 2 to produce the end-on Cu2O2 complex, {(TMPA')Cu(II)}2(mu-1,2-O2(2-) (9). Addition of the tetradentate ligand TMPA to 2 generates the apparently more thermodynamically stable {(TMPA)Cu(II)}2(mu-1,2-S2(2-)) (4) and expected mixture of other species. Bubbling 2 with CO leads to the formation of the carbonyl adduct (TMPA')CuI(CO) (8). Carbonylation/sulfur-release/CO-removal cycles can be repeated several times. Sulfur atom transfer from 2 also occurs in a near quantitative manner when it is treated with 2,6-dimethylphenyl isocyanide (ArNC), leading to the corresponding isothiocyanate (ArNCS) and (TMPA')Cu(I)(CNAr) (12). Complex 2 readily reacts with PhCH2Br: {(TMPA')Cu(II)}2(mu-1,2-S(2)(2-) (2) + 2 PhCH2Br --> {(TMPA')Cu(II)(Br)}2 (6) + PhCH2SSCH2Ph. The unprecedented substrate reactivity studies reveal that end-on bound mu-1,2-disulfide-dicopper(II) complex 2 provides a nucleophilic S2(2-) moiety, in striking contrast to the electrophilic behavior of a recently described side-on bound mu-eta(2):eta(2)-disulfido-dicopper(II) complex, {(N3)Cu(II)}(2)(mu-eta(2):eta(2)-S2(2-)) (5) with tridentate N3 ligand. The investigation thus reveals striking analogies of copper/sulfur and copper/dioxygen chemistries, with regard to structure type formation and specific substrate reactivity patterns.
元素硫(S8)与铜(I)配合物(TMPA')CuI(1)发生可逆反应,其中TMPA'是一种三(2 - 吡啶甲基)胺(TMPA)类似物,在一个吡啶配体臂上带有6 - CH2OCH3取代基,生成一种光谱纯的端基配位二硫代 - 二铜(II)配合物{(TMPA')Cu(II)}2(μ - 1,2 - S2(2 - ))(2){ν(S - S) = 492 cm(-1);ν(Cu - S)sym = 309 cm(-1)};相比之下,(TMPA)Cu(I)(CH3CN)(3)/S8反应产生至少三种配合物的平衡混合物。过量三苯基膦(PPh3)与2反应导致零价硫的形式“释放”以及铜离子还原,生成相应的配合物(TMPA')Cu(I)(PPh3)(11)和S = PPh3作为产物。氧气将二硫部分从2中取代,生成端基配位的Cu2O2配合物{(TMPA')Cu(II)}2(μ - 1,2 - O2(2 - )(9)。向2中加入四齿配体TMPA生成明显热力学更稳定的{(TMPA)Cu(II)}2(μ - 1,2 - S2(2 - ))(4)以及其他物种的预期混合物。用一氧化碳(CO)鼓泡处理2会导致羰基加合物(TMPA')CuI(CO)(8)的形成。羰基化/硫释放/CO去除循环可以重复多次。当用2,6 - 二甲基苯基异氰酸酯(ArNC)处理时,2中的硫原子也以近乎定量的方式转移,生成相应的异硫氰酸酯(ArNCS)和(TMPA')Cu(I)(CNAr)(12)。配合物2很容易与苯甲基溴(PhCH2Br)反应:{(TMPA')Cu(II)}2(μ - 1,2 - S(2)(2 - )(2) + 2 PhCH2Br --> {(TMPA')Cu(II)(Br)}2(6) + PhCH2SSCH2Ph。前所未有的底物反应性研究表明,端基配位μ - 1,2 - 二硫代 - 二铜(II)配合物2提供了一个亲核的S2(2 - )部分,这与最近描述的带有三齿N3配体的侧基配位μ - η(2):η(2) - 二硫代 - 二铜(II)配合物{(N3)Cu(II)}(2)(μ - η(2):η(2) - S2(2 - ))(5)的亲电行为形成鲜明对比。因此,该研究揭示了铜/硫和铜/氧化学在结构类型形成和特定底物反应性模式方面的显著相似性。