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具有低热机械噪声水平的微机械光学麦克风结构。

Micromachined optical microphone structures with low thermal-mechanical noise levels.

作者信息

Hall Neal A, Okandan Murat, Littrell Robert, Bicen Baris, Degertekin F Levent

机构信息

Sandia National Laboratories, Albuquerque, New Mexico 87185, USA.

出版信息

J Acoust Soc Am. 2007 Oct;122(4):2031-7. doi: 10.1121/1.2769615.

Abstract

Micromachined microphones with diffraction-based optical displacement detection have been introduced previously [Hall et al., J. Acoust. Soc. Am. 118, 3000-3009 (2005)]. The approach has the advantage of providing high displacement detection resolution of the microphone diaphragm independent of device size and capacitance-creating an unconstrained design space for the mechanical structure itself. Micromachined microphone structures with 1.5-mm-diam polysilicon diaphragms and monolithically integrated diffraction grating electrodes are presented in this work with backplate architectures that deviate substantially from traditional perforated plate designs. These structures have been designed for broadband frequency response and low thermal mechanical noise levels. Rigorous experimental characterization indicates a diaphragm displacement detection resolution of 20 fm radicalHz and a thermal mechanical induced diaphragm displacement noise density of 60 fm radicalHz, corresponding to an A-weighted sound pressure level detection limit of 24 dB(A) for these structures. Measured thermal mechanical displacement noise spectra are in excellent agreement with simulations based on system parameters derived from dynamic frequency response characterization measurements, which show a diaphragm resonance limited bandwidth of approximately 20 kHz. These designs are substantial improvements over initial prototypes presented previously. The high performance-to-size ratio achievable with this technology is expected to have an impact on a variety of instrumentation and hearing applications.

摘要

基于衍射的光位移检测的微机械麦克风此前已有报道[Hall等人,《美国声学学会杂志》118, 3000 - 3009 (2005)]。该方法的优点是能够提供与器件尺寸和电容无关的麦克风振膜的高位移检测分辨率,为机械结构本身创造了一个不受限制的设计空间。本文介绍了具有1.5毫米直径多晶硅振膜和单片集成衍射光栅电极的微机械麦克风结构,其背板架构与传统的穿孔板设计有很大不同。这些结构设计用于宽带频率响应和低热机械噪声水平。严格的实验表征表明,振膜位移检测分辨率为20 fm/√Hz,热机械引起的振膜位移噪声密度为60 fm/√Hz,对应于这些结构的A加权声压级检测极限为24 dB(A)。测量的热机械位移噪声谱与基于动态频率响应表征测量得出的系统参数的模拟结果非常吻合,模拟结果显示振膜共振限制带宽约为20 kHz。这些设计是对先前展示的初始原型的重大改进。预计该技术可实现的高性能尺寸比将对各种仪器仪表和听力应用产生影响。

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