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使用发光二极管和石英钨卤素灯装置对6种不同代次粘结剂进行光固化时牙髓温度升高的动力学:一项体外模拟研究

Kinetics of pulpal temperature rise during light curing of 6 bonding agents from different generations, using light emitting diode and quartz-tungsten-halogen units: An in-vitro simulation.

作者信息

Khaksaran Najmeh Khatoon, Kashi Tahereh Jafarzadeh, Rakhshan Vahid, Zeynolabedin Zahra Sadat, Bagheri Hossein

机构信息

Department of Dental Biomaterials, Tehran University of Medical Sciences, Tehran, Iran.

Iranian Tissue Bank and Research Center, Department of Dental Materials, Faculty of Dentistry, Research Center for Sciences and Technology in Medicine, Tehran University of Medical Sciences, Tehran, Iran.

出版信息

Dent Res J (Isfahan). 2015 Mar-Apr;12(2):173-80.

Abstract

BACKGROUND

Application of bonding agents (BA) into deep cavities and light curing them might increase pulpal temperature and threaten its health. The purpose of this study was to evaluate temperature rise of pulp by light curing six BA using two different light curing units (LCU), through a dent in wall of 0.5 mm.

MATERIALS AND METHODS

This in vitro experiment was carried out on 96 slices of the same number of human third molars (6 BAs × 2 LCUs × 8 specimens in each group). There were 6 groups of BAs: N Bond, G-Bond, OptiBond XTR, Clearfil SE, Adper Single Bond 2 and V Bond. Each group of BA (n = 16) had two subgroups of light emitting diode (LED) and quartz-tungsten-halogen light cure units (n = 8). Each of these 16 specimens were subjected to light emitting for 20 s, once without any BAs (control) and later when a BA was applied to surface of disk. Temperature rises in 140 s were evaluated. Their mean temperature change in first 20 s were calculated and analyzed using two-way repeated-measures and one-way analysis of variance (ANOVA) and Tukey (α = 0.05). Furthermore rate of temperature increase was calculated for each material and LCU.

RESULTS

Minimum and maximum temperature rises in all subgroups were 1.7 and 2.8°C, respectively. Repeated measures ANOVA showed that both of adhesive and LCU types had significant effect on temperature rise after application of adhesives. Tukey post-hoc analysis showed Clearfil SE showed significantly higher temperature rise in comparison with Adper Single bond 2 (P = 0.047) and N Bond (P = 0.038). Temperature rose in a linear fashion during first 30-40 s and after that it was non-linear.

CONCLUSION

20 s of light curing seems safe for pulpal health (with critical threshold of 5.5°C). However, in longer durations and especially when using LED units, the process should be broken to two sessions.

摘要

背景

将粘结剂(BA)应用于深洞并进行光固化可能会提高牙髓温度并威胁其健康。本研究的目的是通过使用两种不同的光固化单元(LCU),通过0.5毫米的洞壁,评估六种BA光固化时牙髓的温度升高情况。

材料与方法

本体外实验在96片相同数量的人类第三磨牙上进行(每组6种BA×2种LCU×8个标本)。有6组BA:N Bond、G-Bond、OptiBond XTR、Clearfil SE、Adper Single Bond 2和V Bond。每组BA(n = 16)有两个亚组,分别为发光二极管(LED)和石英钨卤素光固化单元(n = 8)。这16个标本中的每一个都先在不使用任何BA的情况下进行20秒的发光(对照),然后在圆盘表面涂抹BA后再次进行。评估140秒内的温度升高情况。计算并使用双向重复测量和单因素方差分析(ANOVA)以及Tukey检验(α = 0.05)分析它们在前20秒内的平均温度变化。此外,还计算了每种材料和LCU的温度升高速率。

结果

所有亚组中的最低和最高温度升高分别为1.7°C和2.8°C。重复测量方差分析表明,粘合剂类型和LCU类型对应用粘合剂后的温度升高均有显著影响。Tukey事后分析表明,与Adper Single bond 2(P = 0.047)和N Bond(P = 0.038)相比,Clearfil SE的温度升高显著更高。温度在最初30 - 40秒内呈线性上升,之后呈非线性上升。

结论

20秒的光固化似乎对牙髓健康是安全的(临界阈值为5.5°C)。然而,在较长时间尤其是使用LED单元时,该过程应分为两个阶段进行。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/609c/4387631/6a5a4f9a36f7/DRJ-12-173-g001.jpg

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