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用于高性能可溶性并苯基晶体管及电路的接触诱导结晶性。

Contact-induced crystallinity for high-performance soluble acene-based transistors and circuits.

作者信息

Gundlach D J, Royer J E, Park S K, Subramanian S, Jurchescu O D, Hamadani B H, Moad A J, Kline R J, Teague L C, Kirillov O, Richter C A, Kushmerick J G, Richter L J, Parkin S R, Jackson T N, Anthony J E

机构信息

Semiconductor Electronics Division, Electronics and Electrical Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8120, USA.

出版信息

Nat Mater. 2008 Mar;7(3):216-21. doi: 10.1038/nmat2122. Epub 2008 Feb 17.

Abstract

The use of organic materials presents a tremendous opportunity to significantly impact the functionality and pervasiveness of large-area electronics. Commercialization of this technology requires reduction in manufacturing costs by exploiting inexpensive low-temperature deposition and patterning techniques, which typically lead to lower device performance. We report a low-cost approach to control the microstructure of solution-cast acene-based organic thin films through modification of interfacial chemistry. Chemically and selectively tailoring the source/drain contact interface is a novel route to initiating the crystallization of soluble organic semiconductors, leading to the growth on opposing contacts of crystalline films that extend into the transistor channel. This selective crystallization enables us to fabricate high-performance organic thin-film transistors and circuits, and to deterministically study the influence of the microstructure on the device characteristics. By connecting device fabrication to molecular design, we demonstrate that rapid film processing under ambient room conditions and high performance are not mutually exclusive.

摘要

有机材料的使用为显著影响大面积电子器件的功能和普及性提供了巨大机遇。这项技术的商业化需要通过利用廉价的低温沉积和图案化技术来降低制造成本,而这些技术通常会导致器件性能较低。我们报告了一种低成本方法,通过改变界面化学来控制溶液浇铸的并苯类有机薄膜的微观结构。化学和选择性地调整源极/漏极接触界面是引发可溶性有机半导体结晶的一条新途径,从而导致在相对的接触面上生长出延伸到晶体管沟道中的结晶薄膜。这种选择性结晶使我们能够制造高性能的有机薄膜晶体管和电路,并确定性地研究微观结构对器件特性的影响。通过将器件制造与分子设计联系起来,我们证明了在环境室温条件下的快速薄膜加工和高性能并非相互排斥。

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