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并行光互连可以减少对称多处理器中的通信瓶颈。

Parallel optical interconnects may reduce the communication bottleneck in symmetric multiprocessors.

作者信息

Collet J H, Hlayhel W, Litaize D

出版信息

Appl Opt. 2001 Jul 10;40(20):3371-8. doi: 10.1364/ao.40.003371.

Abstract

We start with a detailed analysis of the communication issues in today's symmetric multiprocessor (SMP) architectures to study the benefits of implementing optical interconnects (OI) in these machines. We show that the transmission of block addresses is the most critical communication bottleneck of future large SMPs owing to the need to preserve the coherence of data duplicated in caches. An address transmission bandwidth as high as 200-300 Gb/s may be necessary in ten years from now; this requirement will represent a difficult challenge for shared electric buses. In this context we suggest the introduction of simple point-to-point OIs for a SMP cache-coherent switch, i.e., for a VLSI switch that would emulate the shared-bus function. The operation might require as much as 10,000 input-outputs (IOs) to connect 100 processors, particularly if one maintains the present parallelism of transmissions to preserve a large bandwidth and a short memory access latency. The interest for OIs comes from the potential increase of the transmission frequency and from the possible integration of such a high density of IOs on top of electronic chips to overcome packaging issues. Then we consider the implementation of an optical bus that is a multipoint optical line involving more optical technology. This solution allows multiple simultaneous accesses to the bus, but the preservation of the coherence of caches can no longer be maintained with the usual fast snooping protocols.

摘要

我们首先详细分析当今对称多处理器(SMP)架构中的通信问题,以研究在这些机器中实现光互连(OI)的好处。我们表明,由于需要保持高速缓存中复制数据的一致性,块地址的传输是未来大型SMP最关键的通信瓶颈。从现在起十年后,可能需要高达200 - 300 Gb/s的地址传输带宽;这一要求对共享电气总线来说将是一项艰巨的挑战。在此背景下,我们建议为SMP高速缓存一致性交换机引入简单的点对点OI,即用于模拟共享总线功能的超大规模集成电路(VLSI)交换机。该操作可能需要多达10,000个输入输出(IO)来连接100个处理器,特别是如果要保持当前的传输并行性以保留大带宽和短内存访问延迟的话。OI的优势源于传输频率的潜在提高以及在电子芯片顶部集成如此高密度IO以克服封装问题的可能性。然后我们考虑实现一种光总线,它是一种涉及更多光学技术的多点光线路。这种解决方案允许同时对总线进行多次访问,但使用常规的快速监听协议已无法再保持高速缓存的一致性。

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