首次展示了在单个硅衬底上集成激光器、光调制器和光电探测器的高密度光互连。

First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrate.

作者信息

Urino Yutaka, Shimizu Takanori, Okano Makoto, Hatori Nobuaki, Ishizaka Masashige, Yamamoto Tsuyoshi, Baba Takeshi, Akagawa Takeshi, Akiyama Suguru, Usuki Tatsuya, Okamoto Daisuke, Miura Makoto, Noguchi Masataka, Fujikata Junichi, Shimura Daisuke, Okayama Hideaki, Tsuchizawa Tai, Watanabe Toshifumi, Yamada Koji, Itabashi Seiichi, Saito Emiko, Nakamura Takahiro, Arakawa Yasuhiko

机构信息

Institute for Photonics-Electronics Convergence System Technology (PECST), Japan.

出版信息

Opt Express. 2011 Dec 12;19(26):B159-65. doi: 10.1364/OE.19.00B159.

DOI:10.1364/OE.19.00B159

PMID:22274013

Abstract

Engineers are currently facing some technical issues in support of the exponential performance growths in information industries. One of the most serious issues is a bottleneck of inter-chip interconnects. We propose a new "Photonics-Electronics Convergence System" concept. High density optical interconnects integrated with a 13-channel arrayed laser diode, silicon optical modulators, germanium photodetectors, and silicon optical waveguides on single silicon substrate were demonstrated for the first time using this system. A 5-Gbps error free data transmission and a 3.5-Tbps/cm(2) transmission density were achieved. We believe that this technology will solve the bandwidth bottleneck problem among LSI chips in the future.

摘要

工程师们目前在支持信息产业指数级性能增长方面面临一些技术问题。最严重的问题之一是芯片间互连的瓶颈。我们提出了一种新的“光子 - 电子融合系统”概念。首次使用该系统展示了在单个硅衬底上集成有13通道阵列激光二极管、硅光调制器、锗光电探测器和硅光波导的高密度光互连。实现了5 Gbps的无差错数据传输和3.5 Tbps/cm²的传输密度。我们相信这项技术将在未来解决大规模集成电路芯片之间的带宽瓶颈问题。