Hansi Christopher, Arab Amina, Rzany Alexander, Ahrens Ingo, Bode Christoph, Hehrlein Christoph
Department of Cardiology and Angiology, University of Freiburg, Freiburg, Germany.
Catheter Cardiovasc Interv. 2009 Mar 1;73(4):488-96. doi: 10.1002/ccd.21834.
Coronary stenting is considered to be the gold standard of percutaneous coronary interventions, because stents are able to reduce early and late elastic recoil (negative remodeling) and restenosis in comparison with balloon angioplasty alone.
It is known that stent thrombogenicity and neointimal formation are determined by the surface characteristics of the stent platform, electrochemical features of the stent surface, and the degree of degradation after implantation. Metallic stents coated with amorphous silicon carbide and biodegradable stents made of magnesium alloy have been introduced clinically, but there are no data available comparing the biocompatibility of these novel stent materials with conventional stents.
We demonstrate simple and reproducible in vitro methods assessing the rate of platelet adhesion and thrombus activation for biocompatibility tests of different stent surfaces.
We show that amorphous silicon carbide and magnesium alloy stent surfaces markedly lower the rate of platelet adhesion and platelet/fibrin activation when compared with uncoated stainless steel or cobalt chromium alloy surfaces. Semiconductor materials on the stent surface reduce platelet and fibrin activation by increasing the critical electron gap to greater than 0.9 eV resulting in a lower electron transfer out of the stent material.
Passive stent coatings with specific semiconducting properties such as amorphous silicon carbide or magnesium alloy reduce thrombogenicity and may improve biocompatibility of a stent platform.
冠状动脉支架置入术被认为是经皮冠状动脉介入治疗的金标准,因为与单纯球囊血管成形术相比,支架能够减少早期和晚期弹性回缩(负性重塑)以及再狭窄。
已知支架的血栓形成性和新生内膜形成由支架平台的表面特征、支架表面的电化学特性以及植入后的降解程度决定。涂覆非晶硅碳化物的金属支架和由镁合金制成的可生物降解支架已被临床应用,但尚无数据比较这些新型支架材料与传统支架的生物相容性。
我们展示了用于评估不同支架表面生物相容性的简单且可重复的体外方法,以测定血小板黏附率和血栓激活率。
我们发现,与未涂层的不锈钢或钴铬合金表面相比,非晶硅碳化物和镁合金支架表面显著降低了血小板黏附率以及血小板/纤维蛋白激活率。支架表面的半导体材料通过将临界电子能隙增加至大于0.9电子伏特,减少了血小板和纤维蛋白激活,从而降低了从支架材料中传出的电子转移。
具有特定半导体特性的被动支架涂层,如非晶硅碳化物或镁合金,可降低血栓形成性,并可能改善支架平台的生物相容性。