Chowdhury Ihtesham, Prasher Ravi, Lofgreen Kelly, Chrysler Gregory, Narasimhan Sridhar, Mahajan Ravi, Koester David, Alley Randall, Venkatasubramanian Rama
Intel Corporation, Chandler, Arizona 85226, USA.
Nat Nanotechnol. 2009 Apr;4(4):235-8. doi: 10.1038/nnano.2008.417. Epub 2009 Jan 25.
There is a significant need for site-specific and on-demand cooling in electronic, optoelectronic and bioanalytical devices, where cooling is currently achieved by the use of bulky and/or over-designed system-level solutions. Thermoelectric devices can address these limitations while also enabling energy-efficient solutions, and significant progress has been made in the development of nanostructured thermoelectric materials with enhanced figures-of-merit. However, fully functional practical thermoelectric coolers have not been made from these nanomaterials due to the enormous difficulties in integrating nanoscale materials into microscale devices and packaged macroscale systems. Here, we show the integration of thermoelectric coolers fabricated from nanostructured Bi2Te3-based thin-film superlattices into state-of-the-art electronic packages. We report cooling of as much as 15 degrees C at the targeted region on a silicon chip with a high ( approximately 1,300 W cm-2) heat flux. This is the first demonstration of viable chip-scale refrigeration technology and has the potential to enable a wide range of currently thermally limited applications.
在电子、光电子和生物分析设备中，对特定位置和按需冷却有重大需求，目前这些设备的冷却通过使用庞大和/或设计过度的系统级解决方案来实现。热电装置可以解决这些限制，同时还能实现节能解决方案，并且在开发具有更高优值的纳米结构热电材料方面已经取得了重大进展。然而，由于将纳米级材料集成到微米级设备和封装的宏观系统中存在巨大困难，尚未用这些纳米材料制造出功能齐全的实用热电冷却器。在此，我们展示了由纳米结构的Bi2Te3基薄膜超晶格制成的热电冷却器集成到先进的电子封装中。我们报告了在具有高（约1300 W cm-2）热通量的硅芯片上的目标区域实现了高达15摄氏度的冷却。这是可行的芯片级制冷技术的首次演示，并且有潜力实现目前许多受热限制的应用。
