Lee Byoung H, Hwang Jae K, Nam Jae W, Lee Song U, Kim Jun T, Koo Sang-M, Baunemann A, Fischer Roland A, Sung Myung M
Department of Chemistry, Hanyang University, Seoul 133-791, Korea.
Angew Chem Int Ed Engl. 2009;48(25):4536-9. doi: 10.1002/anie.200900414.
A uniform, conformal, pure copper metal thin film was grown at very low substrate temperatures (100-120 degrees C) on Si(100) substrates by atomic layer deposition involving the ligand exchange of [Cu(OCHMeCH(2)NMe(2))(2)] with Et(2)Zn (see scheme). Patterned copper thin films of Cu nanotubes (diameter 150 nm, length 12 microm) were fabricated.
通过涉及[Cu(OCHMeCH(2)NMe(2))(2)]与Et(2)Zn配体交换的原子层沉积方法,在非常低的衬底温度(100 - 120摄氏度)下,在Si(100)衬底上生长出均匀、保形的纯铜金属薄膜(见示意图)。制备了直径为150纳米、长度为12微米的铜纳米管图案化铜薄膜。