Hooshmand Tabassom, Mahmoodi Nasrin, Keshvad Alireza
Department of Dental Materials, School of Dentistry/Research Center for Science and Technology in Medicine, Tehran University of Medical Sciences, Tehran, Iran.
J Prosthodont. 2009 Jul;18(5):411-6. doi: 10.1111/j.1532-849X.2009.00449.x. Epub 2009 Mar 26.
This study evaluated the curing efficiency of light-emitting diode (LED) and halogen [quartz tungsten halogens (QTH)] lights through ceramic by determining the surface microhardness of a highly filled resin cement.
Resin cement specimens (Variolink Ultra; with and without catalyst) (5-mm diameter, 1-mm thick) were condensed in a Teflon mold. They were irradiated through a ceramic disc (IPS Empress 2, diameter 5 mm, thickness 2 mm) by high-power light-curing units as follows: (1) QTH for 40 seconds (continuous), (2) LED for 20 seconds, and (3) LED for 40 seconds (5-second ramp mode). The specimens in control groups were cured under a Mylar strip. Vickers microhardness was measured on the top and bottom surfaces by a microhardness tester. Data were analyzed using analysis of variance (ANOVA) and a post hoc Bonferroni test at a significance level of p < 0.05.
The mean microhardness values of the top and bottom surfaces for the dual-cured cement polymerized beneath the ceramic by QTH or LED (40 seconds) were significantly higher than that of light-cured cement (p < 0.05). The top and bottom surface microhardness of dual-cured cement polymerized beneath the ceramic did not show a statistically significant difference between the LED and QTH for 40 seconds (p > 0.05).
The efficiency of high-power LED light in polymerization of the resin cement used in this study was comparable to the high-power QTH light only with a longer exposure time. A reduced curing time of 20 seconds with high-power LED light for photopolymerizing the dual-cured resin cement under ceramic restorations with a minimum 2-mm thickness is not recommended.
本研究通过测定高填充树脂水门汀的表面显微硬度,评估发光二极管(LED)灯和卤素灯[石英卤钨灯(QTH)]透过陶瓷材料时的固化效率。
将树脂水门汀试件(Variolink Ultra;含催化剂和不含催化剂)(直径5mm,厚1mm)在聚四氟乙烯模具中压实。通过如下高功率光固化装置,使其透过陶瓷圆盘(IPS Empress 2,直径5mm,厚2mm)进行照射:(1)QTH灯照射40秒(持续照射),(2)LED灯照射20秒,(3)LED灯照射40秒(5秒斜坡模式)。对照组试件在聚酯薄膜条下固化。使用显微硬度测试仪在顶面和底面测量维氏显微硬度。采用方差分析(ANOVA)和事后Bonferroni检验对数据进行分析,显著性水平为p<0.05。
通过QTH灯或LED灯(40秒)在陶瓷下方聚合的双固化水门汀顶面和底面的平均显微硬度值显著高于光固化水门汀(p<0.05)。在陶瓷下方聚合的双固化水门汀顶面和底面显微硬度在LED灯照射40秒和QTH灯照射40秒之间无统计学显著差异(p>0.05)。
本研究中使用的高功率LED灯在树脂水门汀聚合方面的效率仅在曝光时间更长时与高功率QTH灯相当。不建议在厚度至少为2mm的陶瓷修复体下,使用高功率LED灯以20秒的缩短固化时间对双固化树脂水门汀进行光聚合。