Lin Jia-Chuan, Chen Wei-Lun, Tsai Wei-Chih
Opt Express. 2006 Oct 16;14(21):9764-9. doi: 10.1364/oe.14.009764.
A new approach for the fabrication of n-type porous silicon layer is proposed. A hole-rich p-layer is arranged underneath the n-layer, and the np-junction is under forward biased condition in the etching process. Therefore sufficient holes can drift straight-upward and pass across the np-junction from p-region to n-region to participate in electrochemical reaction during the etching process with an unfailing supply. Illumination is an optional hole-supplier in this approach, so the problem of illumination-depth limitation can be overcome. Strong visible photoluminescence emissions are demonstrated on the hole-poor n-type porous layer at about 650 nm.
提出了一种制备n型多孔硅层的新方法。在n层下方布置一个富空穴的p层,并且在蚀刻过程中np结处于正向偏置条件。因此,在蚀刻过程中,足够的空穴能够直接向上漂移并穿过np结从p区进入n区,持续不断地参与电化学反应。在这种方法中,光照是一种可选的空穴供应源,因此可以克服光照深度限制的问题。在贫空穴的n型多孔层上,在约650nm处显示出强烈的可见光致发光发射。