Yao J Y, Dunlop G L
Department of Physics, Chalmers University of Technology, Göteborg, Sweden.
J Electron Microsc Tech. 1991 Sep;19(1):90-8. doi: 10.1002/jemt.1060190109.
A technique is described for the preparation of thin specimens for transmission electron microscopy (TEM) of (InGa)As/GaAs multilayered materials. In this technique, a shielding method is used for selective-area perforation by ion beam thinning. Thin cross-sectional specimen slices are mechanically pre-thinned to about 30 microns and then thinned by ion sputtering from one side of the specimen at a time without rotation of the specimen stage. No direct ion sputtering occurs at the growth surface of the specimen so that a specimen with thin areas containing the desired near-surface structures can be obtained. The recipe for this technique is given in detail. A patterning method for increasing the size of the thin area for TEM investigation is also described. It is shown that a smooth surface can be obtained by sputtering without rotating the stage if obstacles that produce redeposits onto the sputtered surface are removed.
本文描述了一种用于制备(InGa)As/GaAs多层材料透射电子显微镜(TEM)薄试样的技术。在该技术中,采用一种屏蔽方法通过离子束减薄进行选区穿孔。薄的横截面试样切片先通过机械方法预减薄至约30微米,然后在不旋转试样台的情况下从试样的一侧一次进行离子溅射减薄。在试样的生长表面不会发生直接离子溅射,从而可以获得具有包含所需近表面结构的薄区域的试样。详细给出了该技术的工艺方法。还描述了一种用于增加TEM研究薄区域尺寸的图案化方法。结果表明,如果去除在溅射表面产生再沉积的障碍物,则在不旋转试样台的情况下进行溅射可以获得光滑表面。