Department of Chemistry and Biochemistry, University of Windsor, Windsor, Ontario, Canada N9B 3P4.
J Am Chem Soc. 2010 Jan 20;132(2):765-72. doi: 10.1021/ja908433p.
We report a simple, low-cost method for the fabrication of copper wires and contacts on a wide range of flexible, rigid, and inert polymeric substrates. This method relies on procedures to oxidize the polymeric substrates to form surface-bound carboxylic acid groups. Patterning of an aluminum porphyrin ink using microcontact printing results in the formation of an aluminum porphyrin monolayer that is covalently anchored to the oxidized polymer surface via an aluminum-carboxylate bond. We characterize this monolayer using ultraviolet-visible absorption spectra, reflection-absorption infrared spectroscopy, and contact angle measurements. Patterned aluminum porphyrin monolayers bind a Pd/Sn colloidal catalyst from solution that subsequently initiates the selective deposition of copper in an electroless plating solution. We demonstrate the fabrication of patterned copper films on a variety of both flexible and rigid polymers with minimum feature sizes of 2 microm over 2 cm(2) substrates. Measurements of electrical resistivity of copper wires fabricated on flexible poly(ethylene naphthalate) (PEN) substrates as a function of the bending radius show no negative impact on electrical performance at bending radii as small as 500 microm. Permanently damaging the PEN substrate by creasing (corresponding to a bending radius of 100 microm) results in only a modest increase in resistivity.
我们报告了一种在广泛的柔性、刚性和惰性聚合物衬底上制造铜丝和触点的简单、低成本方法。该方法依赖于氧化聚合物衬底以形成表面结合的羧酸基团的程序。使用微接触印刷对铝卟啉油墨进行图案化，导致形成通过铝-羧酸酯键共价固定在氧化聚合物表面上的铝卟啉单层。我们使用紫外可见吸收光谱、反射吸收红外光谱和接触角测量来表征该单层。图案化的铝卟啉单层从溶液中结合 Pd/Sn 胶体催化剂，随后在无电电镀溶液中引发铜的选择性沉积。我们在各种柔性和刚性聚合物上展示了图案化铜膜的制造，最小特征尺寸为 2 微米，在 2 cm(2)衬底上。在柔性聚萘二甲酸乙二醇酯 (PEN) 衬底上制造的铜丝的电阻率测量作为弯曲半径的函数，在弯曲半径小至 500 微米时，对电性能没有负面影响。通过折痕（对应于弯曲半径为 100 微米）永久损坏 PEN 衬底仅导致电阻率略有增加。
