Hsu Chih-Hao, Yeh Ming-Chih, Lo Kung-Lung, Chen Li-Jen
Department of Chemical Engineering, National Taiwan University, Taipei, Taiwan.
Langmuir. 2007 Nov 20;23(24):12111-8. doi: 10.1021/la7023988. Epub 2007 Oct 18.
Microcontact printing (microCP) and electroless plating are combined to produce microscale patterns of silver on glass substrates. Silver patterns with feature sizes of 0.6-10 microm stripes are fabricated using two methods. (1) The printing seeding layer (PSL) method is to apply microCP to directly print the catalyst Sn pattern for further electroless plating. (2) The printing masking layer (PML) method is to use microCP to print the octadecyltrichlorosilane (OTS) self-assembled monolayer as a masking layer on glass substrates, which then become Sn-activated in the unstamped regions by immersing the substrates in stannous chloride solution. After the electroless silver plating, the PML method has a better selectivity of silver deposition than the PSL method. In addition, variation of the deposited silver thickness as a function of the plating time and temperature is discussed.
微接触印刷(microCP)与化学镀相结合,在玻璃基板上制备银的微尺度图案。采用两种方法制作特征尺寸为0.6 - 10微米条纹的银图案。(1)印刷籽晶层(PSL)法是应用微接触印刷直接印刷催化剂锡图案,以便进一步进行化学镀。(2)印刷掩膜层(PML)法是使用微接触印刷在玻璃基板上印刷十八烷基三氯硅烷(OTS)自组装单分子层作为掩膜层,然后通过将基板浸入氯化亚锡溶液中,使未压印区域被锡活化。化学镀银后,PML法比PSL法具有更好的银沉积选择性。此外,还讨论了沉积银厚度随镀覆时间和温度的变化情况。