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通过溶胶-凝胶法对正十八烷进行二氧化硅封装:一种新型的具有高导热性和性能的微封装相变材料。

Silica encapsulation of n-octadecane via sol-gel process: a novel microencapsulated phase-change material with enhanced thermal conductivity and performance.

机构信息

Key Laboratory of Beijing City on Preparation and Processing of Novel Polymer Materials, School of Materials Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, China.

出版信息

J Colloid Interface Sci. 2010 Mar 1;343(1):246-55. doi: 10.1016/j.jcis.2009.11.036. Epub 2009 Nov 23.

DOI:10.1016/j.jcis.2009.11.036
PMID:20035943
Abstract

A novel microencapsulated phase-change material (PCM) based on an n-octadecane core and an inorganic silica shell was designed to enhance thermal conductivity and phase-change performance. These silica microcapsules were synthesized by using TEOS as an inorganic source through a sol-gel process. Fourier transform infrared spectra confirm that the silica shell material was successfully fabricated onto the surface of the n-octadecane core. Scanning electronic microscopy images suggest that the silica microcapsules exhibit a spherical morphology with a well-defined core-shell microstructure. Furthermore, the silica microcapsules synthesized at pH 2.45 display a smooth and compact surface. These microcapsules also present a large particle size range of 7-16 microm. Wide-angle X-ray scattering patterns indicate that the n-octadecane inside the silica microcapsules still retains a good crystallinity. Thermogravimetric analysis shows that these silica microcapsules are degraded in two distinct steps, and have good thermal stability. The silica-microencapsulated n-octadecane can achieve good phase-change performance, high encapsulation efficiency, and good antiosmosis property by controlling the loading of core material and acidity of the reaction solution during the sol-gel process. The thermal conductivity of the microencapsulated n-octadecane is also significantly enhanced due to the presence of the high thermal conductive silica shell.

摘要

一种新型的基于正十八烷核和无机二氧化硅壳的微胶囊相变材料(PCM)被设计用来提高导热性和相变性能。这些二氧化硅微胶囊是通过使用 TEOS 作为无机源,通过溶胶-凝胶过程合成的。傅里叶变换红外光谱证实,成功地在正十八烷核表面制备了二氧化硅壳材料。扫描电子显微镜图像表明,二氧化硅微胶囊呈现出球形形态,具有明确的核壳微观结构。此外,在 pH 值为 2.45 下合成的二氧化硅微胶囊具有光滑而紧凑的表面。这些微胶囊还呈现出 7-16 微米的大粒径范围。广角 X 射线散射图谱表明,二氧化硅微胶囊内部的正十八烷仍保留着良好的结晶度。热重分析表明,这些二氧化硅微胶囊在两步中降解,并且在溶胶-凝胶过程中通过控制核材料的负载和反应溶液的酸度具有良好的热稳定性。通过控制核材料的负载和反应溶液的酸度,微胶囊化的正十八烷可以实现良好的相变性能、高封装效率和良好的反渗透性能。由于存在高导热性的二氧化硅壳,微胶囊化的正十八烷的导热系数也得到了显著提高。

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