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配体对金纳米棒热耗散的影响。

Effect of ligands on thermal dissipation from gold nanorods.

机构信息

Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA.

出版信息

Langmuir. 2010 Mar 16;26(6):3786-9. doi: 10.1021/la904855s.

Abstract

Thermal interface conductance was measured for soluble gold nanorods (NRs) coated with mercaptocarboxylic acids (HS-(CH(2))(n)COOH, n = 5, 10, 15), thiolated polyethylene glycols (MW = 356, 1000, 5000), and HS-(CH(2))(15)-COOH-coated NRs further coated with alternating layers of poly(diallyldimethylammonium chloride) and poly(sodium styrenesulfonate). Ferguson analysis determined ligand thickness. The thermal-diffusion-dominated regime of transient absorption spectra was fit to a continuum heat diffusion finite element model to obtain the thermal interface conductance, G, which varied with ligand chemistry but not molecule length. The results suggest that the ability to exclude water from the NR surface governs ligand G values.

摘要

热界面电导测量了巯基羧酸(HS-(CH(2))(n)COOH,n = 5、10、15)、巯基聚乙二醇(MW = 356、1000、5000)和巯基-(CH(2))(15)-COOH 涂覆的金纳米棒(NRs)进一步涂覆了交替层的聚二烯丙基二甲基氯化铵和聚(苯乙烯磺酸钠)。费格森分析确定了配体的厚度。瞬态吸收光谱的热扩散主导区域被拟合到连续热扩散有限元模型中,以获得热界面电导 G,它随配体化学而变化,但与分子长度无关。结果表明,能够将水从 NR 表面排除的能力控制了配体 G 值。

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