Department of Mechanical Engineering, Yale University, New Haven, CT 06520, USA.
Proc Natl Acad Sci U S A. 2010 Mar 16;107(11):4834-9. doi: 10.1073/pnas.1001410107. Epub 2010 Mar 1.
Fundamental to the development of three-dimensional microelectronic fabrication is a material that enables vertical geometries. Here we show low-melting-point metal alloys containing iron dispersions that can be remotely manipulated by magnetic fields to create vertical geometries and thus enable novel three-dimensional assemblies. These iron dispersions enhance the mechanical properties needed for strong, reliable interconnects without significantly altering the electrical properties of the alloys. Additionally, these iron dispersions act as susceptors for magnetic induction heating, allowing the rapid melting of these novel alloys at temperatures lower than those usually reported for conventional metal alloys. By localizing high temperatures and by reducing temperature excursions, the materials and methods described have potential in a variety of device fabrication applications.
对于三维微电子制造的发展而言，基础在于开发出一种能够实现垂直结构的材料。在这里，我们展示了包含铁分散体的低熔点金属合金，这些分散体可以通过磁场进行远程操控，从而形成垂直结构，从而实现新颖的三维组件。这些铁分散体增强了所需的机械性能，从而实现了坚固、可靠的互连，而不会显著改变合金的电性能。此外，这些铁分散体可用作磁感应加热的感应器，从而使这些新型合金在低于通常报道的传统金属合金的温度下快速熔化。通过使高温局部化并减少温度波动，所描述的材料和方法在各种器件制造应用中具有潜力。
