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Ni/Al薄膜的闭场非平衡磁控溅射离子镀:磁控功率的影响

Closed field unbalanced magnetron sputtering ion plating of Ni/Al thin films: influence of the magnetron power.

作者信息

Said R, Ahmed W, Gracio J

机构信息

School of Computing, Engineering and Physical Sciences, University of Central Lancashire, Preston PR1 2HE, UK.

出版信息

J Nanosci Nanotechnol. 2010 Apr;10(4):2558-63. doi: 10.1166/jnn.2010.1455.

DOI:10.1166/jnn.2010.1455
PMID:20355462
Abstract

In this study NiAl thin films have been deposited using closed field unbalanced magnetron sputtering Ion plating (CFUBMSIP). The influence of magnetron power has been investigated using dense and humongous NiAl compound targets onto stainless steel and glass substrates. Potential applications include tribological, electronic media and bond coatings in thermal barrier coatings system. Several techniques has been used to characterise the films including surface stylus profilometry, energy dispersive spectroscopy (EDAX), X-Ray diffraction (XRD) Composition analysis of the samples was carried out using VGTOF SIMS (IX23LS) and Atomic force microscopy (AFM). Scratch tester (CSM) combined with acoustic emission singles during loading in order to compare the coating adhesion. The acoustic emission signals emitted during the indentation process were used to determine the critical load, under which the film begins to crack and/or break off the substrate. The average thickness of the films was approximately 1 um. EDAX results of NiAl thin films coating with various magnetron power exhibited the near equal atomic% Ni:Al. The best result being obtained using 300 W and 400 W DC power for Ni and Al targets respectively. XRD revealed the presence of beta NiAl phase for all the films coatings. AFM analysis of the films deposited on glass substrates exhibited quite a smooth surface with surface roughness values in the nanometre range. CSM results indicate that best adhesion was achieved at 300 W for Ni, and 400 W for Al targets compared to sample other power values. SIMS depth profile showed a uniform distribution of the Ni and Al component from the surface of the film to the interface.

摘要

在本研究中,采用闭合场非平衡磁控溅射离子镀(CFUBMSIP)沉积了NiAl薄膜。使用致密且巨大的NiAl复合靶材,在不锈钢和玻璃基板上研究了磁控功率的影响。潜在应用包括热障涂层系统中的摩擦学、电子介质和粘结涂层。已使用多种技术对薄膜进行表征,包括表面触针轮廓仪、能量色散光谱(EDAX)、X射线衍射(XRD)。使用VGTOF SIMS(IX23LS)和原子力显微镜(AFM)对样品进行成分分析。划痕测试仪(CSM)在加载过程中结合声发射信号,以比较涂层附着力。压痕过程中发出的声发射信号用于确定临界载荷,在该载荷下薄膜开始开裂和/或从基板上脱落。薄膜的平均厚度约为1μm。不同磁控功率下NiAl薄膜涂层的EDAX结果显示Ni:Al原子百分比接近相等。分别使用300W和400W直流功率对Ni靶和Al靶时获得了最佳结果。XRD显示所有薄膜涂层中均存在β-NiAl相。对沉积在玻璃基板上的薄膜进行AFM分析,结果显示表面相当光滑,表面粗糙度值在纳米范围内。CSM结果表明,与其他功率值的样品相比,Ni靶在300W、Al靶在400W时获得了最佳附着力。SIMS深度剖析表明,从薄膜表面到界面,Ni和Al组分分布均匀。

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