Wang Yuehui, Zhou Weidong
Department of Electrical Engineering, NanoFAB Center, University of Texas at Arlington, Arlington, TX 76019-0072, USA.
J Nanosci Nanotechnol. 2010 Mar;10(3):1563-83. doi: 10.1166/jnn.2010.2030.
In recent years, there has been a growing interest in the self-assembly process for the fabrication of micro- and nano-scale structures for various device applications. The success of these applications requires the development of a versatile assembly process for producing large area ordered arrays. In this article, we review recent advances, particularly related to photonic material and device applications, based on self-assembly processes, with the focus on the processes for inorganic structure self assembly. We first discuss major forces guiding the particle self-assembly in the wet coating technology. Then we review device applications and recent advances based on three kinds of wet coating technologies, including dip coating, spin coating and convective coating. Finally, a conclusion will be given, with discussions given on future perspectives.
近年来，人们对用于制造各种器件应用的微米和纳米级结构的自组装过程越来越感兴趣。这些应用的成功需要开发一种用于生产大面积有序阵列的通用组装工艺。在本文中，我们回顾了基于自组装过程的近期进展，特别是与光子材料和器件应用相关的进展，重点是无机结构自组装的过程。我们首先讨论在湿涂覆技术中引导颗粒自组装的主要力。然后我们回顾基于三种湿涂覆技术（包括浸涂、旋涂和对流涂覆）的器件应用和近期进展。最后，将给出结论，并对未来前景进行讨论。
