Department of Materials Science and Engineering, University of Pennsylvania, 3231 Walnut Street, Philadelphia, Pennsylvania 19104, USA.
Acc Chem Res. 2010 Aug 17;43(8):1080-91. doi: 10.1021/ar100001a.
High aspect-ratio (HAR) micropillar arrays have many interesting and technologically important applications. Their properties, such as large mechanical compliance, large surface area, and a topography that is well-separated from the underlying substrate, have allowed researchers to design and explore biomimetic dry adhesives, superhydrophobic, superoleophobic, and tunable wetting surfaces, mechanical sensors and actuators, and substrates for cell mechanics studies. However, the mechanical compliance and large surface area of the micropillars also make these structures susceptible to deformation by adhesive and capillary surface forces. As a result such micropillars, particularly those made from soft polymers, can prove challenging to fabricate and to use in various applications. Systematic understanding of these forces is thus critical both to assemble stable micropillar arrays and to harness these surface forces toward controlled actuation for various applications. In this Account, we review our recent studies on the stability of HAR polymeric micropillar arrays against adhesive and capillary forces. Using the replica molding method, we have successfully fabricated HAR epoxy micropillar arrays with aspect ratios up to 18. The stability of these arrays against adhesive forces is in agreement with theoretical predictions. We have also developed a new two-step replica molding method to fabricate HAR (up to 12) hydrogel micropillar arrays using monomers or monomer mixtures. By varying the monomer composition in the fabrication process, we have fabricated a series of hydrogel micropillar arrays whose elastic moduli in wet state range from less than a megapascal to more than a gigapascal, and we have used these micropillar arrays to study capillary force induced clustering behavior as a function of the modulus. As a result, we have shown that as liquid evaporates off the micropillar arrays, the pillars bend and cluster together because of a much smaller capillary meniscus interaction force while the micropillar structures are surrounded by a continuous liquid body. Previously, researchers had often attributed this clustering effect to a Laplace pressure difference because of isolated capillary bridges. Our theoretical analysis of stability against capillary force and micropillar cluster size as a function of pillar elastic modulus agrees well with our experimental observations. The fabrication approaches presented here are quite general and will enable the fabrication of tall, stable micropillar arrays in a variety of soft, responsive materials. Therefore, researchers can use these materials for various applications: sensors, responsive wetting, and biological studies. The new insights into the capillary force induced clustering of micropillar arrays could improve rational design and fabrication of micropillar arrays that are stable against capillary force. In addition, these results could help researchers better manipulate capillary force to control the assembly of micropillar arrays and actuate these structures within novel devices.
高纵横比(HAR)微柱阵列在许多有趣且具有重要技术意义的应用中具有重要地位。HAR 微柱阵列的性质,如大的机械顺应性、大的表面积以及与基底分离的形貌,使得研究人员能够设计和探索仿生干性粘合剂、超疏水、超疏油和可调润湿性表面、机械传感器和致动器以及细胞力学研究的基底。然而,微柱的大机械顺应性和大表面积也使这些结构容易受到粘附力和毛细表面力的变形。因此,这些结构,特别是由软聚合物制成的结构,在各种应用中制造和使用都具有挑战性。因此,系统地理解这些力对于组装稳定的微柱阵列以及利用这些表面力进行各种应用的受控致动至关重要。在本报告中,我们综述了我们最近对 HAR 聚合物微柱阵列抵抗粘附力和毛细力的稳定性的研究。我们使用复制模塑法成功地制造了高达 18 的 HAR 环氧树脂微柱阵列。这些阵列对粘附力的稳定性与理论预测一致。我们还开发了一种新的两步复制模塑法,使用单体或单体混合物制造 HAR(高达 12)水凝胶微柱阵列。通过在制造过程中改变单体组成,我们制造了一系列水凝胶微柱阵列,其在湿状态下的弹性模量范围从小于 1 兆帕斯卡到大于 10 吉帕斯卡,并且我们使用这些微柱阵列研究了作为模量函数的毛细力诱导的团聚行为。结果表明,由于液体从微柱阵列蒸发,当微柱结构被连续的液体体包围时,微柱弯曲并由于毛细弯月面相互作用力小而聚集在一起。在此之前,研究人员常常将这种团聚效应归因于孤立的毛细桥之间的拉普拉斯压力差。我们对毛细力稳定性的理论分析和作为柱弹性模量函数的微柱团聚大小与我们的实验观察结果非常吻合。这里提出的制造方法非常通用,可以在各种软响应材料中制造高大、稳定的微柱阵列。因此,研究人员可以将这些材料用于各种应用:传感器、响应性润湿和生物学研究。对毛细力诱导的微柱阵列团聚的新见解可以改善对抗毛细力稳定的微柱阵列的合理设计和制造。此外,这些结果可以帮助研究人员更好地控制毛细力来控制微柱阵列的组装并在新型器件中致动这些结构。