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使用胶黏带进行稳健且多功能的微流控组件的快速原型制作。

Rapid prototyping of robust and versatile microfluidic components using adhesive transfer tapes.

机构信息

Bioscience, Los Alamos National Laboratory, Los Alamos, NM 87545, USA.

出版信息

Lab Chip. 2010 Sep 7;10(17):2286-91. doi: 10.1039/c002457k. Epub 2010 Jun 30.

Abstract

A rapid prototyping technique of microfluidic devices is presented using adhesive transfer tapes. Lab on a chip systems can integrate multiple microfluidic functions in a single platform. Therefore, any rapid prototyping technique should be flexible and robust to accommodate different aspects of microfluidic integrations. In this work, the versatility of using adhesive transfer tapes for microfluidic applications is demonstrated by fabricating a wide range of platform. Prototypes demonstrating microfluidic mixing, dielectrophoretic trapping, complex microchannel networks and biologically relevant high temperature reactions were fabricated in less than 30 min. A novel ready to use world-to-chip interface was also developed using the same fabrication platform. All components (e.g. tapes, electrodes, acoustic sources or heaters) were obtained as finished products alleviating any chemical or clean-room specific processing. Only a 2D CAD software, a CO2 laser cutter and a seam roller was utilized to fabricate the devices. Adhesive transfer tapes provide additional flexibility compared to common double sided tapes as they do not contain any carrier material layer. Demonstrated ability to sustain in a wide range of dynamic physical processes (mechanical, electrical, or thermal) validates the robustness and the versatility of adhesive transfer tapes as an option for developing integrated lab on a chip systems.

摘要

提出了一种使用压敏胶带的微流控器件快速成型技术。芯片实验室系统可以在单个平台上集成多个微流控功能。因此,任何快速原型制作技术都应该具有灵活性和鲁棒性,以适应微流控集成的不同方面。在这项工作中,通过制作各种平台,展示了使用压敏胶带进行微流控应用的多功能性。在不到 30 分钟的时间内制作了用于微混合、介电泳捕获、复杂微通道网络和与生物学相关的高温反应的原型。还使用相同的制造平台开发了一种新颖的即用型芯片接口。所有组件(例如胶带、电极、声源或加热器)均作为成品获得,无需进行任何化学或洁净室特定处理。仅使用二维 CAD 软件、CO2 激光切割机和缝辊即可制造设备。与常见的双面胶带相比,压敏胶带提供了更大的灵活性,因为它们不包含任何载体材料层。在广泛的动态物理过程(机械、电气或热)中展示的承受能力验证了压敏胶带作为开发集成芯片实验室系统的一种选择的鲁棒性和多功能性。

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