Electrical and Computer Engineering Department, Northeastern University, Boston MA 02115 USA.
IEEE Trans Nanobioscience. 2010 Sep;9(3):193-203. doi: 10.1109/TNB.2010.2053047.
This paper proposes a novel model for gross damage as occurring in tile-based nanomanufacturing by DNA self-assembly. Gross damage occurs due to exogenous agents (such as radiation and tip-sample interactions) and is modeled as a hole (with a large number of empty tile sites) in the aggregate of the self-assembly. A stochastic analysis based on Markov chains for the tile binding process is pursued for regrowth of the tiles. This analysis establishes resilience as the probability to regrow the target pattern in the area affected by the gross damage. The conditions by which regrowth of a hole is favorable (i.e., at high resilience) compared with normal growth are established by considering temperature of aggregation and bond energy. As examples, two patterns for nano interconnects are analyzed based on the proposed model.
本文提出了一种新的模型，用于研究基于瓷砖的纳米制造中由 DNA 自组装引起的总损伤。总损伤是由外部因素（如辐射和针尖-样品相互作用）引起的，被建模为自组装聚集体中的一个孔（有大量空的瓷砖位）。基于马尔可夫链的瓷砖结合过程的随机分析被用于研究瓷砖的再生。该分析将弹性定义为在受总损伤影响的区域中重新生成目标图案的概率。通过考虑聚集温度和键能，确定了孔的再生条件（即高弹性）与正常生长相比是否有利。作为示例，基于所提出的模型分析了两种纳米互连的图案。
