School of Nano-Bioscience and Chemical Engineering, Ulsan National Institute of Science and Technology (UNIST), Banyeon-ri 100, Ulsan, 689-798, Republic of Korea.
Lab Chip. 2011 Mar 7;11(5):962-5. doi: 10.1039/c0lc00272k. Epub 2010 Dec 8.
We describe a simple and versatile method for bonding thermoplastics to elastomeric polydimethylsiloxane (PDMS) at room temperature. The bonding of various thermoplastics including polycarbonate (PC), cyclic olefin copolymer (COC), polymethylmethacrylate (PMMA), and polystyrene (PS), to PDMS has been demonstrated at room temperature. An irreversible bonding was formed instantaneously when the thermoplastics, activated by oxygen plasma followed by aminopropyltriethoxysilane modification, were brought into contact with the plasma treated PDMS. The surface modified thermoplastics were characterized by water contact angle measurements and X-ray photoelectron spectroscopy. The tensile strength of the bonded hybrid devices fabricated with PC, COC, PMMA, and PS was found to be 430, 432, 385, and 388 kPa, respectively. The assembled devices showed high burst resistance at a maximum channel pressure achievable by an in-house built syringe pump, 528 kPa. Furthermore, they displayed very high hydrolytic stability; no significant change was observed even after the storage in water at 37 °C over a period of three weeks. In addition, this thermoplastic-to-PDMS bonding technique has been successfully employed to fabricate a relatively large sized device. For example, a lab-on-a-disc with a diameter of 12 cm showed no leakage when it spins for centrifugal fluidic pumping at a very high rotating speed of 6000 rpm.
我们描述了一种简单而通用的室温下将热塑性塑料与弹性体聚二甲基硅氧烷（PDMS）键合的方法。已经证明了各种热塑性塑料，包括聚碳酸酯（PC）、环状烯烃共聚物（COC）、聚甲基丙烯酸甲酯（PMMA）和聚苯乙烯（PS），可以在室温下与 PDMS 键合。当热塑性塑料经过氧等离子体处理并用氨丙基三乙氧基硅烷改性后，与等离子体处理的 PDMS 接触时，会立即形成不可逆的键合。用接触角测量法和 X 射线光电子能谱法对表面改性的热塑性塑料进行了表征。用 PC、COC、PMMA 和 PS 制造的键合混合器件的拉伸强度分别为 430、432、385 和 388kPa。组装的器件在自制注射器泵可达到的最大通道压力 528kPa 下显示出很高的抗爆裂性。此外，它们表现出很高的水解稳定性；即使在 37°C 的水中储存三周，也没有观察到明显的变化。此外，这种热塑性塑料与 PDMS 的键合技术已成功应用于制造相对较大尺寸的器件。例如，直径为 12cm 的盘上实验室在以 6000rpm 的高转速旋转进行离心流体制动时，没有出现泄漏。
