Université Paul Cézanne Aix Marseille, Laboratoire de Mécanique, Modélisation et Procédés Propres (M2P2 - UMR-CNRS 6181), Europôle de l'Arbois, BP. 80, Bâtiment Laennec, Hall C, 13545 Aix en Provence Cedex 04, France; KEMESYS, 125 ZA Verdalai, 13790 Peynier, France.
J Hazard Mater. 2011 Aug 30;192(2):440-50. doi: 10.1016/j.jhazmat.2011.05.016. Epub 2011 Jun 6.
The purpose of the present study is to develop a process to regenerate the polish liquid used in Chemical and Mechanical Polishing (CMP), called "slurry", and more specifically Silicon CMP slurry. Physico-chemical analyses show a considerable dilution of slurry through washing waters used in polishing. Thus, this effluent has been characterised for a better identification of the deviations from the slurry of reference (Point Of Use). Hence, the principle is to regenerate this effluent by membrane processes. The ultrafiltration results obtained at laboratory scale have led to the development of an industrial prototype. An optimal utilisation of this treatment allows completing a two-step process: the reconcentration by ultrafiltration and a chemical adjustment by addition of concentrated slurry. A stable behaviour of the slurry at the different steps of the process has been observed. Polishing results are similar with retreated and POU slurries. Furthermore, the functioning at industrial scale permits to maintain the performances obtained on the laboratory pilot.
本研究的目的是开发一种用于化学机械抛光（CMP）中所用的抛光液（即“浆料”）的再生工艺，更具体地说是用于硅 CMP 浆料的再生工艺。物理化学分析表明，在抛光过程中使用的洗涤水会导致浆料大量稀释。因此，本研究对该废水进行了特征分析，以便更好地识别其与参考浆料（使用点）之间的偏差。因此，其原理是通过膜处理来再生该废水。实验室规模的超滤结果促使开发了工业原型。这种处理方法的最佳利用可以完成两步处理过程：通过超滤进行浓缩和通过添加浓缩浆料进行化学调整。在处理过程的不同步骤中，浆料的性能均保持稳定。经处理后的浆料与使用点的浆料的抛光效果相似。此外，在工业规模上运行可以保持实验室中获得的性能。
