Department of Electrical Engineering and Materials Science and Engineering Program, Bourns College of Engineering, University of California, Riverside, California 92521, USA.
Nat Mater. 2011 Jul 22;10(8):569-81. doi: 10.1038/nmat3064.
Recent years have seen a rapid growth of interest by the scientific and engineering communities in the thermal properties of materials. Heat removal has become a crucial issue for continuing progress in the electronic industry, and thermal conduction in low-dimensional structures has revealed truly intriguing features. Carbon allotropes and their derivatives occupy a unique place in terms of their ability to conduct heat. The room-temperature thermal conductivity of carbon materials span an extraordinary large range--of over five orders of magnitude--from the lowest in amorphous carbons to the highest in graphene and carbon nanotubes. Here, I review the thermal properties of carbon materials focusing on recent results for graphene, carbon nanotubes and nanostructured carbon materials with different degrees of disorder. Special attention is given to the unusual size dependence of heat conduction in two-dimensional crystals and, specifically, in graphene. I also describe the prospects of applications of graphene and carbon materials for thermal management of electronics.
近年来，科学界和工程界对材料的热性能产生了浓厚的兴趣。在电子行业不断发展的过程中，散热已经成为一个关键问题，而低维结构中的热传导则呈现出了真正引人入胜的特性。碳的同素异形体及其衍生物在导热方面具有独特的优势。碳材料的室温热导率跨度非常大——超过五个数量级——从非晶碳的最低值到石墨烯和碳纳米管的最高值。在这里，我将重点介绍最近关于石墨烯、碳纳米管和不同无序程度的纳米结构碳材料的研究结果，综述碳材料的热性能。特别关注二维晶体，尤其是石墨烯中热传导的异常尺寸依赖性。我还描述了石墨烯和碳材料在电子设备热管理方面的应用前景。
