Future Convergence Research Division, Korea Institute of Science and Technology, Seoul, Korea.
Nanotechnology. 2011 Sep 30;22(39):395705. doi: 10.1088/0957-4484/22/39/395705. Epub 2011 Sep 6.
Pulse management of white light to maximize the sintering efficiency of a rapid (msec) and substrate-protective method, intense pulsed light (IPL), was studied systematically with a printable Cu nanoink. An excessive pulse energy that induces deleterious defects on the Cu film along with damage on a plastic substrate was dissipated into multiple sub-pulses while maintaining a total energy budget over the threshold level for successful Cu sintering. Electrical properties of the metal layers were analyzed in conjunction with pulse formation factors such as average energy, pulse duration, peak power and pulse number to determine their respective effects on IPL sintering. In the quantitative results, the optimized sintering conditions of copper nanoparticles with a mean diameter of 30 nm and a fixed total irradiated pulse energy of 32 J cm(-2) were a pulse number and pulse width of > 4 and < 3 msec, respectively.
采用可打印的铜纳米墨水，系统研究了白光脉宽管理，以最大限度地提高快速（毫秒级）和基底保护方法——强脉冲光（IPL）的烧结效率。过多的脉冲能量会在铜膜上产生有害缺陷，并对塑料基底造成损伤，这些能量在超过成功烧结铜的阈值总能量预算的情况下，通过多个子脉冲耗散。结合平均能量、脉冲持续时间、峰值功率和脉冲数量等脉冲形成因素，分析了金属层的电性能，以确定它们对 IPL 烧结的各自影响。在定量结果中，对于平均直径为 30nm 的铜纳米颗粒，优化的烧结条件是固定的总辐照脉冲能量为 32Jcm(-2)，脉冲数和脉冲宽度分别大于 4ms 和小于 3ms。
