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用于喷墨3D打印的混合油墨配方及IPL烧结工艺的优化

Optimization of Hybrid Ink Formulation and IPL Sintering Process for Ink-Jet 3D Printing.

作者信息

Lee Jae-Young, Choi Cheong-Soo, Hwang Kwang-Taek, Han Kyu-Sung, Kim Jin-Ho, Nahm Sahn, Kim Bum-Seok

机构信息

Icheon Branch, Korea Institute of Ceramic Engineering & Technology, Icheon 17303, Korea.

Department of Material Science and Engineering, Korea University, Seoul 02841, Korea.

出版信息

Nanomaterials (Basel). 2021 May 14;11(5):1295. doi: 10.3390/nano11051295.

DOI:10.3390/nano11051295
PMID:34069153
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC8157234/
Abstract

Ink-jet 3D printing technology facilitates the use of various materials of ink on each ink-jet head and simultaneous printing of multiple materials. It is suitable for manufacturing to process a complex multifunctional structure such as sensors and printed circuit boards. In this study, a complex structure of a SiO insulation layer and a conductive Cu layer was fabricated with photo-curable nano SiO ink and Intense Pulsed Light (IPL)-sinterable Cu nano ink using multi-material ink-jet 3D printing technology. A precise photo-cured SiO insulation layer was designed by optimizing the operating conditions and the ink rheological properties, and the resistance of the insulation layer was 2.43 × 10 Ω·cm. On the photo-cured SiO insulation layer, a Cu conductive layer was printed by controlling droplet distance. The sintering of the IPL-sinterable nano Cu ink was performed using an IPL sintering process, and electrical and mechanical properties were confirmed according to the annealing temperature and applied voltage. Then, Cu conductive layer was annealed at 100 °C to remove the solvent, and IPL sintered at 700 V. The Cu conductive layer of the complex structure had an electrical property of 29 µΩ·cm and an adhesive property with SiO insulation layer of 5B.

摘要

喷墨3D打印技术便于在每个喷墨头上使用各种油墨材料，并能同时打印多种材料。它适用于制造诸如传感器和印刷电路板等复杂的多功能结构。在本研究中，使用多材料喷墨3D打印技术，用可光固化的纳米SiO油墨和强脉冲光（IPL）可烧结的Cu纳米油墨制造了SiO绝缘层和导电Cu层的复杂结构。通过优化操作条件和油墨流变性能设计了精确的光固化SiO绝缘层，该绝缘层的电阻为2.43×10Ω·cm。在光固化的SiO绝缘层上，通过控制液滴间距印刷Cu导电层。使用IPL烧结工艺对IPL可烧结的纳米Cu油墨进行烧结，并根据退火温度和施加电压确认其电学和力学性能。然后，将Cu导电层在100°C下退火以去除溶剂，并在700V下进行IPL烧结。该复杂结构的Cu导电层的电学性能为29µΩ·cm，与SiO绝缘层的粘附性能为5B。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/2d0c7c47256a/nanomaterials-11-01295-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/a7aa64d033a8/nanomaterials-11-01295-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/e3cfbd2b8d5c/nanomaterials-11-01295-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/3fc71d4b2c8d/nanomaterials-11-01295-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/946a9a9d7707/nanomaterials-11-01295-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/4bab9a055951/nanomaterials-11-01295-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/25218c4ecace/nanomaterials-11-01295-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/dbf97ed29d15/nanomaterials-11-01295-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/54afb66d55bf/nanomaterials-11-01295-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/615f322db897/nanomaterials-11-01295-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/489b2e90dd9f/nanomaterials-11-01295-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/028202570125/nanomaterials-11-01295-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/2d0c7c47256a/nanomaterials-11-01295-g012.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/a7aa64d033a8/nanomaterials-11-01295-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/e3cfbd2b8d5c/nanomaterials-11-01295-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/3fc71d4b2c8d/nanomaterials-11-01295-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/946a9a9d7707/nanomaterials-11-01295-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/4bab9a055951/nanomaterials-11-01295-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/25218c4ecace/nanomaterials-11-01295-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/dbf97ed29d15/nanomaterials-11-01295-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/54afb66d55bf/nanomaterials-11-01295-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/615f322db897/nanomaterials-11-01295-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/489b2e90dd9f/nanomaterials-11-01295-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/028202570125/nanomaterials-11-01295-g011.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/929c/8157234/2d0c7c47256a/nanomaterials-11-01295-g012.jpg

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