Department of Nanobiochemistry, Frontiers of Innovative Research in Science and Technology (FIRST), Konan University, 7-1-20 Minatojimaminami, Kobe 650-0047, Japan.
Langmuir. 2011 Oct 4;27(19):11761-6. doi: 10.1021/la2025318. Epub 2011 Sep 13.
We report a fully additive-based electrochemical approach to the site-selective deposition of silver on a polyimide substrate. Using a cathode coated with ion-doped precursor polyimide layers, patterns of metal masks used as anodes were successfully reproduced at the cathode-precursor interface through electrochemical and ion-exchange reactions, which resulted in the generation of silver patterns on the polyimide films after subsequent annealing and removal from the substrate. Excellent interfacial adhesion was achieved through metal nanostructures consisting of interconnecting silver nanoparticles at the metal-polymer interface, which are electrochemically grown "in" the precursor layer. This approach is a resist- and etch-free process and thus provides an effective methodology toward lower-cost and high-throughput microfabrication.
我们报告了一种完全基于添加剂的电化学方法，用于在聚酰亚胺基底上进行银的选择性沉积。使用涂覆有掺杂离子的前体聚酰亚胺层的阴极，通过电化学和离子交换反应，成功地在阴极-前体界面上复制了用作阳极的金属掩模的图案，这导致在随后的退火和从基底上去除后，在聚酰亚胺薄膜上生成了银图案。通过金属-聚合物界面处互连的银纳米颗粒组成的金属纳米结构实现了优异的界面附着力，这些纳米颗粒是在前体层中“电化学生长”的。这种方法是一种无抗蚀剂和无蚀刻的工艺，因此为低成本和高通量微制造提供了一种有效的方法。
