Interfacial thermal conductance of transfer-printed metal films.
作者信息
Oh Dong-Wook, Kim Seok, Rogers John A, Cahill David G, Sinha Sanjiv
机构信息
Department of Materials Science and Engineering, Materials Research Laboratory, University of Illinois, Urbana, Illinois 61801, USA.
出版信息
Adv Mater. 2011 Nov 16;23(43):5028-33, 5027. doi: 10.1002/adma.201102994. Epub 2011 Oct 4.
PMID:21972101
Abstract
摘要
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