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用于微机电系统的微型乐高积木。

Micro-LEGO for MEMS.

作者信息

Kim Seok

机构信息

Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, 1206 West Green Street, Urbana, Illinois 61801, USA.

出版信息

Micromachines (Basel). 2019 Apr 21;10(4):267. doi: 10.3390/mi10040267.

Abstract

The recently developed transfer printing-based microassembly called micro-LEGO has been exploited to enable microelectromechanical systems (MEMS) applications which are difficult to achieve using conventional microfabrication. Micro-LEGO involves transfer printing and thermal processing of prefabricated micro/nanoscale materials to assemble structures and devices in a 3D manner without requiring any wet or vacuum processes. Therefore, it complements existing microfabrication and other micro-assembly methods. In this paper, the process components of micro-LEGO, including transfer printing with polymer stamps, material preparation and joining, are summarized. Moreover, recent progress of micro-LEGO within MEMS applications are reviewed by investigating several example devices which are partially or fully assembled via micro-LEGO.

摘要

最近开发的基于转移印刷的微组装技术——微乐高(micro-LEGO),已被用于实现微机电系统(MEMS)应用,而这些应用使用传统微加工方法很难实现。微乐高包括对预制的微/纳米级材料进行转移印刷和热处理,以三维方式组装结构和器件,无需任何湿法或真空工艺。因此,它补充了现有的微加工和其他微组装方法。本文总结了微乐高的工艺组件,包括用聚合物印章进行转移印刷、材料制备和连接。此外,通过研究几个通过微乐高部分或完全组装的示例器件,综述了微乐高在MEMS应用中的最新进展。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bb4f/6523840/6174a70f59c0/micromachines-10-00267-g001.jpg

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