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超轻设计,实现隐形塑料电子产品。

An ultra-lightweight design for imperceptible plastic electronics.

机构信息

The University of Tokyo, Electrical and Electronic Engineering and Information Systems, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan.

出版信息

Nature. 2013 Jul 25;499(7459):458-63. doi: 10.1038/nature12314.

Abstract

Electronic devices have advanced from their heavy, bulky origins to become smart, mobile appliances. Nevertheless, they remain rigid, which precludes their intimate integration into everyday life. Flexible, textile and stretchable electronics are emerging research areas and may yield mainstream technologies. Rollable and unbreakable backplanes with amorphous silicon field-effect transistors on steel substrates only 3 μm thick have been demonstrated. On polymer substrates, bending radii of 0.1 mm have been achieved in flexible electronic devices. Concurrently, the need for compliant electronics that can not only be flexed but also conform to three-dimensional shapes has emerged. Approaches include the transfer of ultrathin polyimide layers encapsulating silicon CMOS circuits onto pre-stretched elastomers, the use of conductive elastomers integrated with organic field-effect transistors (OFETs) on polyimide islands, and fabrication of OFETs and gold interconnects on elastic substrates to realize pressure, temperature and optical sensors. Here we present a platform that makes electronics both virtually unbreakable and imperceptible. Fabricated directly on ultrathin (1 μm) polymer foils, our electronic circuits are light (3 g m(-2)) and ultraflexible and conform to their ambient, dynamic environment. Organic transistors with an ultra-dense oxide gate dielectric a few nanometres thick formed at room temperature enable sophisticated large-area electronic foils with unprecedented mechanical and environmental stability: they withstand repeated bending to radii of 5 μm and less, can be crumpled like paper, accommodate stretching up to 230% on prestrained elastomers, and can be operated at high temperatures and in aqueous environments. Because manufacturing costs of organic electronics are potentially low, imperceptible electronic foils may be as common in the future as plastic wrap is today. Applications include matrix-addressed tactile sensor foils for health care and monitoring, thin-film heaters, temperature and infrared sensors, displays, and organic solar cells.

摘要

电子设备已从笨重的起源发展为智能、移动的设备。然而,它们仍然是刚性的,这妨碍了它们与日常生活的亲密融合。柔性、纺织和可拉伸电子产品是新兴的研究领域,可能会产生主流技术。已经展示了厚度仅为 3 μm 的钢衬底上具有非晶硅场效应晶体管的可滚动和不可破的背板。在聚合物衬底上,已经在柔性电子设备中实现了 0.1 mm 的弯曲半径。同时,出现了对不仅可以弯曲而且可以顺应三维形状的柔性电子产品的需求。方法包括将封装有硅 CMOS 电路的超薄聚酰亚胺层转移到预拉伸弹性体上,使用与聚酰亚胺岛上的有机场效应晶体管 (OFET) 集成的导电弹性体,以及在弹性衬底上制造 OFET 和金互连以实现压力、温度和光学传感器。在这里,我们提出了一个使电子产品几乎坚不可摧且难以察觉的平台。我们的电子电路直接在超薄(1 μm)聚合物箔上制造,重量轻(3 g m(-2)),超灵活,顺应其周围的动态环境。在室温下形成的具有极薄氧化物栅介电层(几纳米厚)的有机晶体管使具有前所未有的机械和环境稳定性的复杂大面积电子箔成为可能:它们可以承受半径为 5 μm 及更小的重复弯曲,可以像纸一样起皱,在预拉伸弹性体上可拉伸至 230%,并且可以在高温和水基环境中运行。由于有机电子产品的制造成本可能很低,因此未来隐形电子箔可能会像今天的塑料包装一样普遍。应用包括用于医疗保健和监测的矩阵寻址触觉传感器箔、薄膜加热器、温度和红外传感器、显示器和有机太阳能电池。

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