具有耐热修复剂的自修复环氧树脂复合材料。

Self-healing epoxy composite with heat-resistant healant.

机构信息

College of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, P. R. China.

出版信息

ACS Appl Mater Interfaces. 2011 Nov;3(11):4487-95. doi: 10.1021/am201182j. Epub 2011 Oct 24.

DOI:10.1021/am201182j

PMID:21991982

Abstract

To provide self-healing epoxy composite with adequate heat resistance for high-performance application, we developed a novel microencapsulated epoxy/mercaptan healing agent. The key measure lies in usage of diglycidyl ether of bisphenol A (EPON 828) as the polymerizable component and 2,4,6-tris(dimethylaminomethyl)phenol (DMP-30) as the catalyst. Because of the higher thermal stability of EPON 828 and lower volatility of DMP-30, the healing agent and the self-healing composite not only survive high-temperature curing and thermal exposure, but also offer satisfactory capability of autonomous properties restoration, as characterized by both fracture mechanics and fatigue tests. Especially when the operation temperature is not higher than 200 °C, the performance of the healing system is nearly independent of thermal history.

摘要

为了提供具有足够耐热性的自修复环氧树脂复合材料以满足高性能应用的需求，我们开发了一种新型的微胶囊化环氧树脂/巯基修复剂。关键措施在于使用双酚 A 的二缩水甘油醚（EPON 828）作为可聚合成分和 2,4,6-三（二甲氨基甲基）苯酚（DMP-30）作为催化剂。由于 EPON 828 的热稳定性更高，DMP-30 的挥发性更低，修复剂和自修复复合材料不仅在高温固化和热暴露下幸存下来，而且还提供了令人满意的自主性能恢复能力，这可以通过断裂力学和疲劳测试来表征。特别是当操作温度不高于 200°C 时，修复系统的性能几乎与热历史无关。