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碳化辅助二氧化硅纳米线集成到光刻胶衍生的三维碳微电极阵列中。

Carbonization-assisted integration of silica nanowires to photoresist-derived three-dimensional carbon microelectrode arrays.

机构信息

State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, People's Republic of China.

出版信息

Nanotechnology. 2011 Nov 18;22(46):465601. doi: 10.1088/0957-4484/22/46/465601. Epub 2011 Oct 25.

Abstract

We propose a novel technique of integrating silica nanowires to carbon microelectrode arrays on silicon substrates. The silica nanowires were grown on photoresist-derived three-dimensional carbon microelectrode arrays during carbonization of patterned photoresist in a tube furnace at 1000 °C under a gaseous environment of N(2) and H(2) in the presence of Cu catalyst, sputtered initially as a thin layer on the structure surface. Carbonization-assisted nucleation and growth are proposed to extend the Cu-catalyzed vapor-liquid-solid mechanism for the nanowire integration behaviour. The growth of silica nanowires exploits Si from the etched silicon substrate under the Cu particles. It is found that the thickness of the initial Cu coating layer plays an important role as catalyst on the morphology and on the amount of grown silica nanowires. These nanowires have lengths of up to 100 µm and diameters ranging from 50 to 200 nm, with 30 nm Cu film sputtered initially. The study also reveals that the nanowire-integrated microelectrodes significantly enhance the electrochemical performance compared to blank ones. A specific capacitance increase of over 13 times is demonstrated in the electrochemical experiment. The platform can be used to develop large-scale miniaturized devices and systems with increased efficiency for applications in electrochemical, biological and energy-related fields.

摘要

我们提出了一种将二氧化硅纳米线集成到硅衬底上的碳微电极阵列的新技术。在管式炉中,在氮气和氢气的气体环境中,在存在 Cu 催化剂的情况下,将图案化的光刻胶在 1000°C 下碳化,将初始溅射的 Cu 薄层沉积在结构表面上,从而在光刻胶衍生的三维碳微电极阵列上生长二氧化硅纳米线。我们提出了碳化辅助成核和生长,以扩展用于纳米线集成行为的 Cu 催化的气-液-固机制。二氧化硅纳米线的生长利用了 Cu 颗粒下刻蚀硅衬底中的 Si。结果发现,初始 Cu 涂层厚度在形貌和生长的二氧化硅纳米线数量上起着重要作用。这些纳米线的长度可达 100 µm,直径在 50 至 200 nm 之间,初始溅射 30 nm 的 Cu 薄膜。研究还表明,与空白微电极相比,纳米线集成微电极显著提高了电化学性能。在电化学实验中证明了超过 13 倍的比电容增加。该平台可用于开发具有更高效率的大规模小型化设备和系统,适用于电化学、生物和能源相关领域。

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